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Polymer & materials science hiring snapshot · last 7 months
40Open roles
$60–375KSalary range
22.1Roles / month
98%H-1B signals
BachelorTypical degree
1 to 2 monthsHow long roles stay open, typically
Open roles (40)
- Intel Foundry Process Development Engineer - Advanced Lithography Hillsboro, OR· $134k – $189k
- Senior Silicon Photonics Reliability Engineer Albuquerque, NM· $122k – $232k
- Back End( BE) Process Integration Engineer Hillsboro, OR· $104k – $171k
- Module Engineering PhD Intern Summer 2027 Hillsboro, OR· $121k – $121k
- Module Engineer Phoenix, AZ· $121k – $232k
- Packaging Technology Development Graduate Intern Phoenix, AZ· $121k – $121k
- Module Engineering PhD Intern Phoenix, AZ· $121k – $121k
- Semiconductor Packaging Integration Research Manager Phoenix, AZ· $221k – $312k
- Module Engineering PhD Intern New 2027 Hillsboro, OR· $121k – $121k
- NMSI F11X Thin Films Module Engineer-Technologist Albuquerque, NM· $164k – $232k
- Senior Member of Technical Staff, Thin Films Engineer Hillsboro, OR· $156k – $298k
- Substrate Quality and Reliability Engineer Phoenix, AZ· $104k – $199k
- Module Engineering PhD Intern - Wet Etch Hillsboro, OR· $121k – $121k
- Module Development Engineer Hillsboro, OR· $134k – $189k
- Packaging Research and Development Engineer Phoenix, AZ· $134k – $189k
- Materials Research Engineer Hillsboro, OR· $122k – $232k
- Advanced Packaging Integration and Simulation Intern Phoenix, AZ· $121k – $121k
- Semiconductor Packaging Research Engineer Phoenix, AZ· $122k – $232k
- Packaging Module Development Engineer Phoenix, AZ· $134k – $189k
- Quantum Cryoprober Engineer Hillsboro, OR· $142k – $269k
- Semiconductor Research Integration Engineer Hillsboro, OR· $142k – $200k
- Manufacturing and Process Development - Intern, Graduate Hillsboro, OR· $89k – $89k
- Manufacturing and Process Development - Intern, Bachelor’s Hillsboro, OR· $76k – $76k
- Ocotillo Technology Fabrication Wet Etch Module Engineer Phoenix, AZ· $89k – $146k
- NMSi Module Engineer Albuquerque, NM· $104k – $146k
- Transistor Reliability and Quality Engineer Hillsboro, OR· $156k – $220k
- Back-End TD Reliability Lab Manager Phoenix, AZ· $181k – $255k
- Material Analysis Lab Technician Hillsboro, OR· $60k – $85k
- Thin Films Module Development Engineer Hillsboro, OR· $134k – $189k
- Ocotillo Technology Fabrication DSIRE (Diffusion) Module Engineer Phoenix, AZ· $89k – $171k
- Silicon Photonics Component Design Engineer Albuquerque, NM· $142k – $269k
- Ocotillo Failure Analysis Engineer – TEM/Probing Engineer Phoenix, AZ· $104k – $171k
- Senior Technologist, Hybrid Bonding Module Hillsboro, OR· $181k – $255k
- Principal Engineer, Module Development – CMP Hillsboro, OR· $211k – $298k
- Intel Foundry Module Development Engineer Hillsboro, OR· $134k – $255k
- Process Integration Development Engineer Hillsboro, OR· $115k – $220k
- Director, Process Engineer – Dry Etch Hillsboro, OR· $211k – $298k
- Staff Chemical Mechanical Planarization (CMP) Engineer Hillsboro, OR· $134k – $255k
- OTF Failure Analysis Technician - Night Shift Phoenix, AZ· $60k – $100k
- Principal Engineer, Hybrid Bonding Module Hillsboro, OR· $211k – $298k
Posted again and again
- Module Development Engineerlisted in 3 different months since March 2026
- Packaging Module Development Engineerlisted in 3 different months since April 2026
- Packaging Research and Development Engineerlisted in 3 different months since March 2026
Degree requirements
Top material classes
Most-requested techniques
Role mix
Where they hire
Industries
Work arrangement
72%On-site
28%Hybrid
2%Relocation
Visa & eligibility signals
YesH-1B filing history
5%Need clearance
1%Export-controlled
Sponsorship signals come from posting language plus historical DOL Labor Condition Application data. Confirm specifics with the recruiter.
Posting volume · last 7 months
Mar '26Apr '26May '26Jun '26Jul '26Aug '26Sep '26
155 roles posted across 7 months, averaging 22.1/month.
