Crosslinked
Intel
Polymer & materials science hiring snapshot · last 9 months
44Open roles
$60–375KSalary range
22.4Roles / month
99%H-1B signals
BachelorTypical degree
4Applied here via Crosslinked, 90 days
0 of 5reports unlock the reply rate
1 to 2 monthsHow long roles stay open, typically
Reported by readers who marked a role here as applied. Shown in aggregate only, never per person. How the search is going field-wide
Open roles (44)
- Intel Mask Operations Module Development Engineer Hillsboro, OR · $156k – $220k
- Semiconductor Research Engineer Phoenix, AZ · $142k – $200k
- TEM technician Hillsboro, OR · $63k – $103k
- ATD MIHL Equipment Development Engineer Phoenix, AZ · $99k – $189k
- Staff Chemical Mechanical Planarization (CMP) Engineer Phoenix, AZ · $134k – $255k
- Packaging Module Equipment Development Engineer Chandler, AZ · $85k – $140k
- Packaging Module Equipment Development Engineer Phoenix, AZ · $134k – $189k
- Advanced Packaging Development Engineer Phoenix, AZ · $134k – $189k
- Packaging Module Development Engineer Phoenix, AZ · $134k – $189k
- Module Development Engineer (Ph.D.) - Intel Foundry Hillsboro, OR · $134k – $189k
- Intel Foundry Module Development Engineer - CMP Hillsboro, OR · $134k – $255k
- Thin Films Module Engineering - PhD Intern Hillsboro, OR · $121k – $121k
- Intel Foundry Module Development Engineer – Advanced Wet Etch and Cleans Hillsboro, OR · $134k – $189k
- Module Engineer On Shift (MEOS) Phoenix, AZ · $85k – $163k
- Module Engineer PhD Intern New 2027 Hillsboro, OR · $121k – $121k
- Module Development Engineer Hillsboro, OR · $134k – $189k
- Module Engineering - Day Shift 5 or 7 Phoenix, AZ · $85k – $163k
- Module Engineering - PhD Intern (Advanced Wet Etch and Cleans) Hillsboro, OR · $121k – $121k
- Senior Member of Technical Staff, Thin Films Engineer Hillsboro, OR · $156k – $298k
- 3DIC Platform Wet and Plating Development Manager Hillsboro, OR · $181k – $255k
- Advanced Packaging TD Plating Module Engineer Hillsboro, OR · $134k – $255k
- Packaging Process Development Engineer Phoenix, AZ · $99k – $189k
- (Epi) - Module Development Engineer - (PhD Intern) Hillsboro, OR · $121k – $121k
- Senior Thin Films Metals Deposition Engineer Hillsboro, OR · $134k – $255k
- Intel Foundry Process Development Engineer - Lithography Hillsboro, OR · $134k – $255k
- Advanced Packaging Module Development Engineer Hillsboro, OR · $134k – $255k
- Packaging Module Development Engineer Chandler, AZ · $134k – $189k
- Module Engineer Phoenix, AZ · $121k – $232k
- Semiconductor Packaging Integration Research Manager Phoenix, AZ · $221k – $312k
- Module Engineering PhD Intern New 2027 Hillsboro, OR · $121k – $121k
- Silicon Photonics TD Process/Product Integration Engineer Albuquerque, NM · $115k – $220k
- Module Engineering PhD Intern - Wet Etch Hillsboro, OR · $121k – $121k
- Semiconductor Research Integration Engineer Hillsboro, OR · $142k – $200k
- Manufacturing and Process Development - Intern, Graduate Hillsboro, OR · $89k – $89k
- Manufacturing and Process Development - Intern, Bachelor’s Hillsboro, OR · $76k – $76k
- Transistor Reliability and Quality Engineer Hillsboro, OR · $156k – $220k
- Back-End TD Reliability Lab Manager Phoenix, AZ · $181k – $255k
- Thin Films Module Development Engineer Hillsboro, OR · $134k – $189k
- Ocotillo Technology Fabrication DSIRE (Diffusion) Module Engineer Phoenix, AZ · $89k – $171k
- Silicon Photonics Component Design Engineer Albuquerque, NM · $142k – $269k
- Ocotillo Failure Analysis Engineer – TEM/Probing Engineer Phoenix, AZ · $104k – $171k
- Director, Process Engineer – Dry Etch Hillsboro, OR · $211k – $298k
- Principal Engineer, Hybrid Bonding Module Hillsboro, OR · $211k – $298k
- Senior Wet Etch Manufacturing Development Engineer Hillsboro, OR · $156k – $298k
Posted again and again
- (Epi) - Module Development Engineer - (PhD Intern)listed in 4 different months since March 2026
- Packaging Module Development Engineerlisted in 4 different months since April 2026
- Packaging Module Equipment Development Engineerlisted in 3 different months since March 2026
Degree requirements
Top material classes
Most-requested techniques
Role mix
Where they hire
Industries
Work arrangement
73%On-site
27%Hybrid
2%Relocation
Visa & eligibility signals
YesH-1B filing history
3%Need clearance
1%Export-controlled
Sponsorship signals come from posting language plus historical DOL Labor Condition Application data. Confirm specifics with the recruiter.
H-1B filings for scientists and engineers
Intel filed 974 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025, at a median filed pay of $124K a year.
| Title filed | Filings | Median filed pay |
|---|---|---|
| Process Engineer | 785 | $113K |
| Engineering Manager | 39 | $182K |
| Quality Reliability Engineer | 25 | $109K |
| Industrial Engineer | 22 | $96K |
| SOC Design Engineer | 11 | $183K |
| Packaging Engineer | 9 | $133K |
By occupation: Materials engineers 794 · Engineering managers 120 · Industrial engineers 58 · Mechanical engineers 2. Worksites: OR 683 · NM 101 · AZ 96.
From U.S. Department of Labor Labor Condition Application disclosure data, certified filings only, in chemist, materials, chemical and mechanical engineering, physics, R&D management and science faculty occupations. A filing is a record of past hiring, not a promise about any role. Pay shown needs 3 filings. Compare every employer's filings.
Posting volume · last 9 months
Mar '26Apr '26May '26Jun '26Jul '26Aug '26Sep '26Oct '26Nov '26
202 roles posted across 9 months, averaging 22.4/month.
