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Thin Films Module Engineering - PhD Intern

Intel · Hillsboro, ORtodayverified 1 h ago
$121k – $121k

PhD-level Process Engineering roles on Crosslinked list a median of $124k (20 that show pay).

Support thin film process development, equipment troubleshooting and qualification, and data-driven process control in an Intel fab module.

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Worth knowing

Why it is interesting. Hands-on exposure to thin film process modules across Intel 18A, Intel 3 and 12nm nodes in a high volume fab

Might not be for you. Equipment troubleshooting and maintenance focus, more fab operations than open-ended materials research

Hands-on execution PhD-friendlyFirst industry roleInternship-friendly

Adjacent materials roleThin film manufacturing processes for a semiconductor module (Diffusion, Dielectrics, EPI, FE Metals); process control and equipment qualification

H-1B filings

Intel filed 974 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Process Engineer, Engineering Manager, Quality Reliability Engineer. Median filed pay: $124K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority
Intern/Co-op
Work
On-site
Type
Internship
Degree
PhD
Experience
0+ yrs
Industry
Semiconductor
Role
Process Engineering
Benefits
stock bonuses

Role details

Job Details: Job Description: The Role and Impact As a Module Engineering PhD Intern, you will play a key role in developing and sustaining semiconductor manufacturing processes for a specific module. Your day-to-day responsibilities will include supporting equipment troubleshooting, performing maintenance and qualification activities, and collaborating with engineering teams to optimize process control methodologies. This role offers a unique opportunity to gain hands-on experience in semiconductor manufacturing while building essential skills for a future career in engineering.

Business group You will join the Intel Foundry team, a dynamic and innovative group dedicated to delivering cutting-edge manufacturing solutions that drive Intel's technology forward. The team focuses on advancing semiconductor fabrication processes in areas such as Diffusion, Dielectrics, Implant, EPI, and FE Metals. As part of this group, you will contribute to Intel's mission of creating world-changing technology that enables global progress and enriches lives.

What We Do As members of the Manufacturing Development and Customer Engineering (MDCE) team, we are responsible for improving process capability for multiple technology nodes (Intel 18A, Intel 3, Intel 12nm and upcoming technologies) from initial product qualification through high volume manufacturing. The focus will be on delivering yield improvement, performance enhancement, variation and cost reduction.

Key Responsibilities

Assist with the development and implementation of thin film manufacturing processes for a specific module within Intel's semiconductor production. Support troubleshooting and maintenance activities for manufacturing equipment to ensure optimal performance. Participate in equipment qualification processes, ensuring compliance with quality and functional standards. Collaborate with engineering teams to optimize process control methodologies and achieve production targets. Establish strong working relationships and partner closely with technology development, high volume manufacturing and cross-functional stakeholders to achieve common goals.

Analyze data trends, identify solutions for process improvement and drive automation improvements (using AI where applicable) Contribute to sustaining and improving manufacturing tools and processes while gaining hands-on experience in semiconductor engineering.

Qualifications

Minimum Qualifications

Currently pursuing a PhD degree in a relevant STEM discipline (e.g. Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, Computer Science, etc.). Strong analytical and problem-solving skills. Experience writing software code for application in above majors Excellent communication skills - both written and verbal. Ability to work independently and as part of a diverse, high-performing team. Willingness to work in a cleanroom environment. Strong attention to detail and disciplined approach to procedures. Data analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment.

Preferred Qualifications

Experience with data analysis tools and software (e.g. JMP, Python, Excel, and AI tools). Ability to summarize data for technical and non-technical audiences. Please note, the ideal candidate will be open to work a 6-month internship schedule beginning the Spring of 2027 through December 2027. This is your chance to join a global leader in semiconductor manufacturing, gain real-world experience, and contribute to innovative solutions that shape the future of technology. If you are ready to learn, grow, and make an impact, we encourage you to apply today.

Job Type: Student / Intern Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry.

It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role This role will require an on-site presence. • Job posting details (such as work model, location or time type) are subject to change. • ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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Common questions

What is the salary for the Thin Films Module Engineering - PhD Intern role at Intel?

The listed annual base salary range is $121K–$121K. This figure is taken from the posting itself.

Does Intel sponsor H-1B visas?

Intel has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Thin Films Module Engineering - PhD Intern role. Confirm with the employer before applying if visa support is required.

Where is the Thin Films Module Engineering - PhD Intern role at Intel based?

This role is based in Hillsboro, OR.

What degree is required for the Thin Films Module Engineering - PhD Intern role at Intel?

This role requires a PhD.

How many years of experience does this Thin Films Module Engineering - PhD Intern role require?

The posting calls for at least 0 years of relevant experience.

What techniques or methods are required for this Thin Films Module Engineering - PhD Intern role?

design of experiments, equipment qualification, process control.