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ATD MIHL Equipment Development Engineer

Intel · Phoenix, AZtodayverified 1 h ago
$99k – $189k

BS-level Process Engineering roles on Crosslinked list a median of $115k (783 that show pay).

Develop and optimize semiconductor assembly and packaging processes and equipment, define material specs, and drive packaging reliability.

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Worth knowing

Why it is interesting. Own both assembly process development and the reliability test equipment for next-generation semiconductor packaging.

Might not be for you. Equipment and mechanical-design focused with little hands-on materials R&D; not eligible for visa sponsorship.

Generalist PhD-friendlyBS acceptable

Adjacent materials roleDefine material specifications and collaborate with supplier quality; degree in Materials Science or Metallurgical Engineering; packaging reliability and failure mechanisms

Seniority
Mid-level
Work
On-site
Type
Full-time
Degree
BS
Experience
3+ yrs
Industry
Semiconductor
Role
Process Engineering
Visa
No sponsorship
Benefits
stock bonuses

Role details

Job Details: Job Description: The Role and Impact Join Intel's Packaging Module Development team as a Packaging Module Development Engineer and contribute to advancing innovative assembly and packaging technologies. In this role, you will develop and optimize processes and equipment to support next-generation packaging solutions. Your work will directly enhance manufacturing efficiency, product reliability, and quality, enabling cutting-edge products that shape Intel's leadership in the semiconductor industry. Business Group Intel's Packaging Module Development team focuses on designing and refining assembly and packaging solutions for Intel's diverse product portfolio.

Collaborating with cross-functional teams, this group drives innovation in manufacturing processes and delivers high-quality, reliable solutions that support Intel's mission to deliver world-class technologies to global markets.

Key Responsibilities

Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals. Apply principles of Design of Experiments (DOE) and Statistical Process Control (SPC) to refine processes and specifications, documenting findings through technical reports. Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as temperature cycles, humidity, heat, and dynamic forces. Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.

Define material specifications and collaborate with supplier quality and procurement teams to ensure adherence to quality and performance benchmarks. Innovate new techniques, tools, and quality screens to proactively identify and address packaging reliability challenges. Set reliability benchmarks based on a thorough understanding of failure mechanisms and customer needs. Lead problem-solving initiatives and drive continuous improvement in processes and equipment. Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.

Standardize equipment qualification practices and manufacturing quality systems to align with product milestones and mitigate technical risks.

Qualifications

This position is not eligible for Intel immigration sponsorship.

Minimum Qualifications

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 3+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 2+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field. Experience in the following: Statistical Process Control (SPC) and Design of Experiments (DOE) principles. Mechanical design software, such as SolidWorks or AutoCAD. Mechanical drawings, Geometric Dimensioning, and Tolerancing principles.

Preferred Qualifications

Experience in the following: Program management ability to lead technical innovation and manage complex, time-sensitive projects. Semiconductor fabrication processes, packaging technologies, and robotics. Supply chain management in a manufacturing or materials qualification environment. Take the next step in your career and join Intel's team of innovators dedicated to shaping the future of technology.

Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry.

It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will require an on-site presence. • Job posting details (such as work model, location or time type) are subject to change. • ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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Common questions

What is the salary for the ATD MIHL Equipment Development Engineer role at Intel?

The listed annual base salary range is $99K–$189K. This figure is taken from the posting itself.

Does Intel sponsor work visas for the ATD MIHL Equipment Development Engineer role?

This employer will not provide visa sponsorship for this role.

Where is the ATD MIHL Equipment Development Engineer role at Intel based?

This role is based in Phoenix, AZ.

What degree is required for the ATD MIHL Equipment Development Engineer role at Intel?

The posting accepts the following combinations: BS + 3 years, MS + 2 years, PhD + 0 years.

How many years of experience does this ATD MIHL Equipment Development Engineer role require?

The posting calls for at least 3 years of relevant experience.

What techniques or methods are required for this ATD MIHL Equipment Development Engineer role?

Design of Experiments (DOE), Statistical Process Control (SPC).