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Module Equipment Development Engineer

Intel · Hillsboro, OR,today
$115k – $220k

BS-level Process Engineering roles on Crosslinked list a median of $116k (769 that show pay).

Develop and optimize dielectric thin-film deposition equipment modules and processes for semiconductor manufacturing.

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Worth knowing

Why it is interesting. Equipment and process development on advanced dielectric thin films, working directly with tool suppliers on leading-edge nodes

Might not be for you. Equipment-centric tool development rather than materials discovery; requires semiconductor processing experience

Bench and deskDeep specialist PhD-friendlyBS acceptable

Adjacent materials role:Develop equipment for Dielectrics Thin Films; material selection, thin film deposition, ALD/CVD, SEM/TEM/XPS/ellipsometry characterization

H-1B filings

Intel filed 974 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Process Engineer, Engineering Manager, Quality Reliability Engineer. Median filed pay: $124K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay · Every employer's filings

Seniority
Mid-level
Work
Hybrid
Type
Full-time
Degree
BS
Experience
4+ yrs
Industry
Semiconductor
Role
Process Engineering
Benefits
stock bonuses

Role details

Job Details: Job Description: The Role and Impact: As a Module Equipment Development Engineer, you will lead the development and optimization of advanced semiconductor manufacturing equipment and processes, enabling Intel to deliver high-performance devices. Your contributions will directly impact Intel's technological leadership in the semiconductor industry and advance the capabilities of future technologies. Business Group: Intel Foundry Technology Development is focused on advancing semiconductor process engineering and delivering world-class manufacturing solutions that power Intel's product innovation.

Working within this group, you will collaborate with global teams to develop cutting-edge technologies that enable the design and production of leading-edge devices, helping Intel maintain its leadership in a competitive and fast-paced market.

Key Responsibilities

Develop Equipment capable of delivering on new process requirements in Dielectrics Thin Films. Develop robust Equipment modules that can be transferred seamlessly to high volume manufacturing.

Collaborate with equipment and material suppliers to evaluate, qualify, and implement novel technologies into manufacturing processes Support technology transfer to high-volume manufacturing through training, audits, and maintaining process consistency across sites Design, execute, and analyze experiments to optimize advanced manufacturing processes, including material selection, equipment metrology, and parameter tuning Perform feasibility studies and pathfinding activities to support innovative device architectures and future technology roadmaps Utilize advanced data analysis methods, including Statistical Process Control (SPC) and Design of Experiments (DOE), to guide process improvements and enhance yield Partner with cross-functional teams to ensure seamless process integration and manufacturability Qualifications:

Minimum qualifications

are required to be initially considered for this position.

Preferred qualifications

are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications

Bachelor's degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related STEM field, with 4+ years of industry experience in semiconductor processing OR Master's degree in relevant STEM fields with 3+ years of domain-specific experience OR PhD in Materials Science, Chemical Engineering, Physics, Chemistry, or related STEM field with 6+ months experience in semiconductor processing Industry experience in semiconductor processing/domain-specific experience includes one of more of the following: Proficiency in semiconductor processing techniques such as lithography, etching, thin film deposition, or planarization Expertise in process characterization methods and statistical analysis tools, such as JMP, MATLAB, or Python Familiarity with materials characterization techniques like SEM, TEM, XPS, or ellipsometry Preferred Qualifications: Hands-on experience working with equipment troubleshooting, maintenance, or development in collaboration with suppliers Experience at a Semiconductor manufacturing tool supplier.

Knowledge of manufacturing technologies including vacuum processes, ALD, or CVD Strong problem-solving skills with the ability to manage multiple tasks in a fast-paced environment Collaborative mindset with a proven track record of working across interdisciplinary teams to achieve shared goals For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.

Immigration Sponsorship Information Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. • Job posting details (such as work model, location or time type) are subject to change. • ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process.

Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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Common questions

What is the salary for the Module Equipment Development Engineer role at Intel?

The listed annual base salary range is $115K–$220K. This figure is taken from the posting itself.

Does Intel sponsor H-1B visas?

Intel has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Module Equipment Development Engineer role. Confirm with the employer before applying if visa support is required.

Where is the Module Equipment Development Engineer role at Intel based?

This role is based in Hillsboro, OR. Work arrangement: Hybrid.

What degree is required for the Module Equipment Development Engineer role at Intel?

The posting accepts the following combinations: BS + 4 years, MS + 3 years, PhD + 0 years.

How many years of experience does this Module Equipment Development Engineer role require?

The posting calls for at least 4 years of relevant experience.

What polymers or materials does this Module Equipment Development Engineer role work with?

dielectric thin films.

What techniques or methods are required for this Module Equipment Development Engineer role?

SEM, TEM, XPS, ellipsometry.