Senior Technical Associate
BS-level R&D / Research roles on Crosslinked list a median of $129k (408 that show pay). This posting does not list pay.
Develop and test copper electroplating chemistries for semiconductor dual damascene interconnects, supporting a senior scientist.
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Worth knowing
Why it is interesting. Hands-on formulation and FIB-SEM defect work on Cu plating for future semiconductor technology nodes
Adjacent materials roleR&D developing copper electroplating chemistries and additive packages for dual damascene semiconductor interconnects; electrochemical testing, FIB-SEM/EDS defect analysis
- Seniority
- Mid-level
- Work
- On-site
- Type
- Full-time
- Degree
- BS
- Industry
- Semiconductor
- Role
- R&D / Research
Role details
Are you looking to power the next leap in the exciting world of advanced electronics? Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics. At Qnity , we’re more than a global leader in materials and solutions for advanced electronics and high-tech industries – we’re a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible.
We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us. We are seeking an innovative and hands-on R&D Associate Scientist to support the development of next-generation copper electroplating products for advanced dual damascene semiconductor interconnect applications . This role will work closely with a Senior R&D Scientist and multidisciplinary technical teams to develop, evaluate, and optimize Cu plating chemistries and processes that enable future semiconductor technology nodes.
The successful candidate will proactively contribute to formulation development, electrochemical testing, process characterization, and customer-focused technology development while building expertise in advanced semiconductor metallization. The candidate will be expected to propose and drive experiments, troubleshoot technical challenges, and identify productive next steps.
Key Responsibilities
Plan and execute laboratory research supporting the development of advanced copper electroplating chemistries for dual damascene applications. Prepare and evaluate plating formulations, additive packages, and process conditions. Execute electrochemical experiments and characterize plating performance using established analytical techniques. Perform defect analysis and feature-fill characterization using advanced microscopy and metrology tools such as FIB-SEM, EDS, etc. Analyze experimental data, identify follow-up experiments, and provide recommendations to guide product development decisions. Support technology scale-up, manufacturing transfer, and customer qualification activities.
Maintain laboratory equipment, experimental documentation, and safety compliance. Collaborate closely with senior scientists, engineers, analytical teams, and manufacturing organizations. Prepare technical reports, presentations, and summaries of research findings. Contribute to intellectual property generation through invention disclosures and patent development.
Required Qualifications
B.S. in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, or a related technical field. Strong foundation in electrochemistry, materials science, or wet chemical process development. Experience conducting laboratory experiments and analyzing technical data. Strong problem-solving skills and attention to detail. Effective written and verbal communication skills. Ability to work collaboratively in a team-oriented R&D environment. Demonstrated initiative and willingness to propose experimental approaches, pursue technical questions, and take ownership of assigned research activities.
Preferred Qualifications
Academic or industrial experience in metal electroplating or surface finishing technologies. Familiarity with semiconductor processing, interconnect technologies, or advanced packaging. Knowledge of electrochemical characterization methods. Experience with statistical experimental design and data analysis tools. Exposure to process development and product commercialization activities. Join our Talent Community to stay connected with us! Qnity is an equal opportunity employer.
Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit our Accessibility Page for Contact Information . Qnity offers a comprehensive pay and benefits package. To learn more visit the Compensation and Benefits page . We use Artificial Intelligence (AI) to enhance our recruitment process.
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