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Process Engineer II - Plasma

Leonardo DRS · Dallas, TXtoday

BS-level Process Engineering roles on Crosslinked list a median of $110k (507 that show pay). This posting does not list pay.

Develop and improve plasma etch and vacuum deposition processes for infrared focal plane array wafer fabrication.

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Worth knowing

Why it is interesting. Hands-on with plasma etch and vacuum deposition tools for defense electro-optical systems.

Might not be for you. Requires U.S. citizenship and ability to obtain DOD security clearance; cleanroom-heavy.

Mostly at the benchDeep specialist First industry roleBS acceptable

Adjacent materials roleDevelop and/or improve processes in the Plasma Etch area; deposition and dry etching; sputtering, CVD, evaporation

Seniority
Mid-level
Work
On-site
Type
Full-time
Degree
BS
Experience
2+ yrs
Industry
Defense
Role
Process Engineering
Schedule
Compressed 9/80
Clearance
Ability to obtain
Visa
US citizenship required
Techniques
Benefits
compressed workweekpaid parental leavecommunity service hours

Role details

Job ID: 115306 The Electro Optical Infrared Systems (EOIS) line of business within DRS has locations in Dallas and Austin, TX, Melbourne, FL, and Cypress, CA. EOIS develops, manufactures, and supports infrared and electro-optical solutions for soldiers, ground vehicles and airborne platforms. We offer an exciting and challenging work environment, a competitive salary and benefits package, and a business culture that rewards performance.

*Employing the world’s brightest. Supporting the world’s bravest.* Business Unit: EOIS

Location: Dallas, TX

Career Functional Area: Process Engineering

Telework Type: Onsite

Type: Exempt Full Time Employee

Schedule: 9/80

Shift: First

Job Summary

We are looking to add a new member to our Focal Plane Array team to help provide the vision and technical expertise necessary to drive our development activities needed to lead the industry in product capability and manufacturability. We are looking for someone who can develop and/or improve processes in the Plasma Etch area.

Job Responsibilities

  • Provide process engineering support to the front end wafer processing team. Areas of responsibility will include vacuum tool support to include deposition and dry etching over a variety of process equipment that includes, but it not limited to sputtering, chemical vapor deposition, and evaporation.
  • Continuously improve existing manufacturing processes to optimize yield, increase capacity, and reduce cycle time
  • Troubleshoots and diagnoses problems with existing products and makes modifications and improvements as needed
  • Establish and maintain metrics to validate material quality at various stages in the process flow
  • Analyze and disposition non-conforming material or processes
  • Design, develop, and document new or improved processes and equipment
  • Interact with management, peers, technicians, and support personnel to coordinate technical activities and progress reports
  • Lead and complete projects on schedule and budget

Qualifications

  • U.S. Citizenship is required.
  • Education: Bachelors Degree in Materials Engineering, Manufacturing Engineering, or a related field such as Materials Science, Chemistry, or Physics
  • Experience: 2+ years DESIRED SKILLS
  • Hands on experience using, troubleshooting, and maintaining Plasma etch tools
  • Strong foundation in semiconductors and solid state physics
  • Experience with a variety of plasma etch systems and processes
  • Strong understanding of complimenting metrology tools
  • Organizational skills and the ability to document and communicate plans, experiments, progress, and results
  • Able to effectively manage and balance production requirements and development activities.
  • Working knowledge of DOE, SPC, and formal problem solving methods such as DMAIC
  • Programming and data query experience is a plus
  • Willingness to spend extended periods of time in manufacturing areas or cleanrooms

U.S. Citizenship required. This position requires an active DOD security clearance or the ability to obtain such clearance within a reasonable time after commencement of employment.

Taking care of our people is a top priority at Leonardo DRS. We are proud to offer competitive salaries and comprehensive benefits, including medical, dental, and vision coverage, a company contribution to a health savings account, telemedicine, life and disability insurance, legal insurance, and a 401(k) savings plan. We champion wellness programs that focus on physical, emotional, and financial well-being. We develop our talent by offering programs and activities to support career-growth, professional development, and skill enhancement.

And we understand there is more to life than work, and the importance of offering flexible work schedules with our 9/80 program, competitive vacation, health/emergency leave, paid parental leave, and community service hours.

  • Some employees are eligible for limited benefits only

*Leonardo DRS, Inc. and its subsidiaries provide equal opportunities to all employees and applicants for employment and prohibit discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, protected veteran status, or any other characteristic protected by federal, state, or local laws.*

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Common questions

Does Leonardo DRS sponsor work visas for the Process Engineer II - Plasma role?

This role requires US citizenship — not just permanent residency.

Where is the Process Engineer II - Plasma role at Leonardo DRS based?

This role is based in Dallas, TX.

What degree is required for the Process Engineer II - Plasma role at Leonardo DRS?

This role requires a BS.

How many years of experience does this Process Engineer II - Plasma role require?

The posting calls for at least 2 years of relevant experience.

What techniques or methods are required for this Process Engineer II - Plasma role?

plasma etch, metrology.