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Advanced Packaging Integration Engineer

AMD · Santa Clara, CA,today

BS-level Process Engineering roles on Crosslinked list a median of $116k (764 that show pay). This posting does not list pay.

Lead package process development, test vehicle design and NPI qualification for AMD EPYC server products with suppliers and OSATs.

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Worth knowing

Why it is interesting. Own advanced package integration for flagship EPYC server products, working across OSATs, foundries and global teams

Might not be for you. Program-management and NPI coordination heavy, with only preferred hands-on materials work; no visa sponsorship

Technical lead Senior hires only

Adjacent materials role:Preferred hands-on experience with advanced 3D/2.5D package structures, RDL, bumping, composite materials, and polymers; process development and qualification; Material Science degree accepted

Seniority
Mid-level
Work
On-site
Type
Full-time
Degree
BS
Industry
Semiconductor
Role
Process Engineering
Visa
No sponsorship

Role details

Overview:

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

Responsibilities:

The Role

We’re looking for an experienced Advanced Package Integration Engineer to drive package process development and product NPI (new product introduction) for AMD’s EPYC server products. You will own product and test vehicle package planning, development, and qualification activities working with internal cross-functional teams and external suppliers. The role requires leading global teams to design test vehicles and product packages, develop and qualify processes, and resolve technical and schedule challenges to meet technology and product milestones.

You will regularly report progress to program managers and senior leadership, and work with ecosystem partners to collect and analyze data and implement effective solutions. This position offers the chance to work across multiple disciplines and geographies, influence product strategy, and solve high-impact technical challenges.

The Person

  • Proven experience in semiconductor packaging development, especially for advanced server products.
  • Demonstrated leadership driving cross-functional projects with internal teams and external suppliers.
  • Strong problem-solving track record in yield improvement, reliability, and process development.
  • Excellent written and verbal communication skills with the ability to present complex technical information to diverse audiences.

Responsibilities

  • Define test-vehicle and product-package designs and create execution plans with cross-functional teams.
  • Lead technology development and product NPI, coordinating milestones across geographies and suppliers.
  • Identify technical and schedule risks; develop and implement mitigation plans.
  • Troubleshoot and resolve issues affecting schedule, yield, reliability, and process robustness.
  • Collect, analyze, and present data to drive technical decisions and continuous improvement.
  • Communicate technical status, recommendations, and risks clearly to program managers and senior leadership.
  • Collaborate with material/equipment suppliers, OSATs, foundries, and other ecosystem partners to enable product success.

Preferred Experience

  • Hands-on experience with advanced 3D and 2.5D package structures, wafer-level assembly, substrate assembly, RDL, bumping, composite materials, and polymers.
  • Experience working directly with OSATs, material/equipment suppliers, and foundry partners.
  • Experience leading global project teams and managing NPI schedules and qualifications.

Education

BS/MS/PhD in Mechanical Engineering, Material Science, Electrical Engineering, Chemical Engineering or equivalent

This role is not eligible for visa sponsorship.

#LI-AP1

Qualifications:

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.

We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

Related roles

Common questions

Does AMD sponsor work visas for the Advanced Packaging Integration Engineer role?

This employer will not provide visa sponsorship for this role.

Where is the Advanced Packaging Integration Engineer role at AMD based?

This role is based in Santa Clara, CA.

What degree is required for the Advanced Packaging Integration Engineer role at AMD?

This role asks for a bachelor's degree.

What polymers or materials does this Advanced Packaging Integration Engineer role work with?

composite materials, polymers.