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WPM NM C4 Electroplating Module Engineer

Intel · Albuquerque, NM,today,verified 5 h ago
$89k – $146k

BS-level Process Engineering roles on Crosslinked list a median of $116k (768 that show pay).

Optimize and maintain electroplating process and tools for high-volume wafer packaging manufacturing.

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Worth knowing

Why it is interesting. Owns a core plating process step in Intel's advanced packaging line for AI processors.

Might not be for you. Equipment and tool-maintenance heavy, with limited open-ended materials R&D.

Deep specialist First industry roleBS acceptable

Adjacent materials role:Electroplating module engineer: optimizes manufacturing process, critical dimensions/defectivity, DOE/SPC on a wafer-packaging plating process; Materials Engineering degree listed

H-1B filings

Intel filed 974 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Process Engineer, Engineering Manager, Quality Reliability Engineer. Median filed pay: $124K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay · Every employer's filings

Seniority
Entry level
Work
Hybrid
Type
Full-time
Degree
BS
Experience
2+ yrs
Industry
Semiconductor
Role
Process Engineering
Techniques
metrology tool recipe creation
Benefits
stock bonuses

Role details

Job Details: Job Description: The Role and Impact As a Module Engineer, you will play a key role in optimizing and maintaining critical high-volume manufacturing processes that are essential to Intel's production of cutting-edge semiconductor products. This hands-on role focuses on ensuring equipment reliability, process efficiency, and product quality, directly contributing to Intel's ability to deliver exceptional technology solutions to meet industry demands. Business group You will join Intel's Wafer Packaging Manufacturing organization, a team dedicated to delivering innovation and operational excellence in high-volume production environments.

This group plays a central role in Intel's advanced packaging strategy, which is critical for fabricating high-performance chips like next-generation AI processors.

Key Responsibilities

- Develop, monitor, and optimize manufacturing processes to ensure operational reliability and product quality. - Conduct tests and measurements to control critical dimensions and defectivity within production lines. - Analyze and address process excursions to enhance efficiency and minimize production disruptions. - Collaborate with cross-functional teams to drive manufacturability improvements and process enhancements. - Apply Statistical Process Control and Design of Experiments (DOE) methodologies to refine processes and improve yield. - Perform maintenance, repair, and optimization activities for manufacturing tools and components. - Partner with equipment suppliers to resolve operational issues and implement technological advancements. - Oversee equipment installation, conversion, and qualification during factory ramps, meeting safety and quality standards.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 2+ years of relevant experience in manufacturing process or equipment engineering. OR Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline.

Preferred Qualifications

Experience in Semiconductor Manufacturing or Semiconductor Packaging Manufacturing Experience with Statistical Process Control (SPC), Metrology tool recipe creation, and tool troubleshooting Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, New Mexico, Albuquerque Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $89,010.00-146,440.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. • Job posting details (such as work model, location or time type) are subject to change. • ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process.

Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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Common questions

What is the salary for the WPM NM C4 Electroplating Module Engineer role at Intel?

The listed annual base salary range is $89K–$146K. This figure is taken from the posting itself.

Does Intel sponsor H-1B visas?

Intel has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the WPM NM C4 Electroplating Module Engineer role. Confirm with the employer before applying if visa support is required.

Where is the WPM NM C4 Electroplating Module Engineer role at Intel based?

This role is based in Albuquerque, NM. Work arrangement: Hybrid.

What degree is required for the WPM NM C4 Electroplating Module Engineer role at Intel?

The posting accepts the following combinations: BS + 2 years, MS + 0 years.

How many years of experience does this WPM NM C4 Electroplating Module Engineer role require?

The posting calls for at least 2 years of relevant experience.

What techniques or methods are required for this WPM NM C4 Electroplating Module Engineer role?

metrology tool recipe creation.