Process Integration Engineer

Role details

Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Salary: $147,000.00 - $202,500.00 Location: Santa Clara,CA You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .

As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products.

You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.

Key Responsibilities

Lead process integration for advanced semiconductor and photonic devices, enabling next-generation high-performance interconnect technologies Translate device architectures and design layouts into robust, manufacturable process flows across development and pilot manufacturing Drive C&F activities, including rapid proof-of-concept and prototyping builds Define and track critical process parameters and integration metrics; partner with module owners to optimize unit processes Own end-to-end integration flow execution, including process definition, build scheduling, risk assessment, and readiness Drive yield improvement, SPC, and CIP across complex fabrication flows Conduct optical, electrical, and tolerance analyses to improve device efficiency, scalability, and manufacturability Collaborate cross-functionally with process engineering, product development, design, and production teams to accelerate technology development Engage with external vendors , partners and customers to support technology development, material selection, and process scaling Minimum Qualifications Ph.D. in Electrical Engineering, Materials Science, Physics, or related discipline (Master’s degree with relevant industry experience will be considered ) Strong experience in semiconductor process integration in leading fab / foundry Solid understanding of semiconductor unit processes including l ithography , e tch , t hin film deposition , m etallization , implant, CMP , etc.

Strong experience in yield analysis, metrology, and SPC implementation Experience with simulation and design tools, such as: Cadence , KLayout , AutoCAD , SolidWorks , COMSOL , ANSYS Proven ability to work effectively in matrixed, cross-functional teams Preferred Qualifications Experience in photonic devices, co-packaged optics (CPO), or optical interconnect technologies Background in advanced packaging and heterogeneous integration Key Competencies Demonstrated depth in building, debugging, and optimizing device integration flows. Strong innovation mindset with the ability to develop novel, out-of-the-box integration solutions to complex technical challenges.

Proven ability to influence and align stakeholders without direct authority across diverse functional teams. Clear and structured communication of complex integration challenges, trade-offs, and solutions to both technical and non-technical audiences.

Strong discipline in process documentation, change management, and data-driven decision-making Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 10% of the Time Relocation Eligible: Yes The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement. Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. In addition, Applied endeavors to make our careers site accessible to all users.

If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at [email protected], or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.