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Advanced Packaging Engineer

SAIC · Crane, INtoday

BS-level R&D / Research roles on Crosslinked list a median of $125k (335 that show pay). This posting does not list pay.

Analyze microelectronics packaging and solder interconnects for missile systems using FEA and thermal fatigue modeling.

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Worth knowing

Why it is interesting. Hands-on with advanced packaging for defense missile systems, including solder fatigue and material property evaluations.

Might not be for you. Requires US citizenship and secret clearance; heavy FEA/simulation focus, less hands-on polymer work.

Deep specialist BS acceptableSenior hires only

Adjacent materials roleAnalyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages; solder fatigue analysis and material property evaluations

Seniority
Mid-level
Work
On-site
Type
Full-time
Degree
BS
Experience
3+ yrs
Industry
Defense
Role
R&D / Research
Clearance
Secret
Visa
US citizenship required
Materials
solder interconnects1 role
Techniques
FEA86 rolesthermal fatigue analysisshock and vibration analysissolder fatigue analysismaterial property evaluations

Role details

Job ID 2617366

Location

Crane, IN, US

Date Posted

2026-09-29

Category

Engineering and Sciences

Subcategory

Mechanical Engr

Schedule

Full-Time

Shift

Day Job

Travel

No

Minimum Clearance Required

Interim_Secret

Clearance Level Must Be Able to Obtain

Secret

Potential for Remote Work

ORA_ON_SITE

Description

SAIC is seeking a talented and motivated

Advanced Packaging Engineer

to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems.

JOB RESPONSIBILITES

  • Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly
  • Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling
  • Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation
  • Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR)
  • Collaborate with design teams to facilitate and document design development activities
  • Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions
  • Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages
  • Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations
  • Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders

Qualifications

REQUIRED EDUCATION AND EXPERIENCE

  • Bachelor's degree in Mechanical or Aerospace Engineering
  • We are looking to hire two candidates at different levels
  • 3+ years experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)
  • 10+ years experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)
  • Experience with or knowledge of systems engineering principles
  • Interim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance process
  • Must be a US citizen

Preferred Experience

  • Experience with missile system hardware design and analysis
  • Familiarity with microelectronics packaging and assembly, including solder interconnect technologies

Related roles

Common questions

Does SAIC sponsor work visas for the Advanced Packaging Engineer role?

This role requires US citizenship — not just permanent residency.

Where is the Advanced Packaging Engineer role at SAIC based?

This role is based in Crane, IN.

What degree is required for the Advanced Packaging Engineer role at SAIC?

The posting accepts the following combinations: BS + 3 years, BS + 10 years.

How many years of experience does this Advanced Packaging Engineer role require?

The posting calls for at least 3 years of relevant experience.

What polymers or materials does this Advanced Packaging Engineer role work with?

solder interconnects.

What techniques or methods are required for this Advanced Packaging Engineer role?

FEA, thermal fatigue analysis, shock and vibration analysis.