Microwave Technician Weekend Day Shift - Bonding
Bond and assemble microwave/RF microelectronic modules using epoxy, eutectic die attach and lamination presses
Worth knowing
Why it is interesting. 36 hours paid as 40 plus 10% premium, hands-on with eutectic die attach and sheet epoxies on defense electronics
Might not be for you. Weekend day shift 3AM-3PM Fri-Sun; production bonding role, not R&D
Adjacent materials rolesubstrate attach (duroid/ceramic), MMICs, eutectic die attach; work with lamination presses, bladder bag ovens and sheet epoxies; wide variety of adhesives and epoxies
- Seniority
- Technician
- Work
- On-site
- Type
- Full-time
- Industry
- Defense
- Role
- Manufacturing / Production
- Schedule
- Compressed 4x10
Role details
Please note this position supports our Weekend Day Shift working Friday, Saturday and Sunday from 3:00AM to 3:00PM. You will work 36 Hours and be paid for 40 Hours plus earn a 10% pay premium. See what you’re missing. Our employees work on the world’s most advanced electronics – from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we are developing the technology of tomorrow, delivered today. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life.
We put our customers first – exemplified by our mission: “We Protect Those Who Protect Us®.” Sound like a team you want to be a part of? Come build your career with BAE Systems. Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safely. We are seeking a Microwave Technician for our second shift manufacturing team.
Key Roles and Responsibilities include: Fabricating and/or modifying complex micro-integrated circuit modules or microwave/RF integrated circuit modules and sub-assemblies by following specific instructions, such as for wire and ribbon bonding utilizing various manual and automatic bonding machines or using an MRSI microwave component automated pick and place machine Must be able to perform substrate attach (duroid/ceramic), MMICs, IC's, caps, diodes and resistors, soldering skills and eutectic die attach Must be able to work with lamination presses, bladder bag ovens and sheet epoxies (mainly with the focus of attaching substrates to modules/housings) Must be able to work with a wide variety of adhesives and epoxy's
