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Thin Films Module Development Engineer

Intel · Hillsboro, ORtoday
$156k – $255k

BS-level Process Engineering roles on Crosslinked list a median of $116k (778 that show pay).

Develop and deliver thin-film metals process modules for advanced semiconductor nodes, owning roadmaps and data-driven problem solving.

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Worth knowing

Why it is interesting. Develop metals modules for sub-10nm FinFET and GAA technology in Intel's Hillsboro technology development organization.

Might not be for you. Focus is semiconductor process integration and hardware, not polymer or materials R&D.

Mostly at the benchDeep specialist PhD-friendly

Adjacent materials roleDevelop and deliver metals modules for advanced semiconductor technologies; thin films metals module development; material science, dry etch processes

H-1B filings

Intel filed 974 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Process Engineer, Engineering Manager, Quality Reliability Engineer. Median filed pay: $124K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority
Mid-level
Work
On-site
Type
Full-time
Degree
BS
Experience
6+ yrs
Industry
Semiconductor
Role
Process Engineering
Materials
metals thin films
Benefits
stock bonuses

Role details

Job Details: Job Description: Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers to join the Technology Development organization. The role will be defined by developing and delivering metals modules for advanced semiconductor technologies, leveraging a combination of in-depth hardware knowledge and process expertise to deliver modules that fulfill program process needs within the hardware capabilities. This is a hands-on technical role for results-oriented engineers who can formulate concise technical problem statements, establish a roadmap and timeline, lead with data and partner with stakeholders to deliver on-time results.

Qualifications

Minimum qualifications

are required to be initially considered for this position.

Preferred qualifications

are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 6+ years of experience OR Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 4+ years of experience OR Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 2+ years of experience Experience in semiconductor manufacturing or process development includes one or more of the following: Expertise in process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), and structured problem-solving methodologies Hands-on expertise in dry etch processes, material science, and equipment metrology Technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials Preferred Qualifications: Doctoral degree in a relevant engineering or science field Experience with sub-10nm technology nodes and advanced device architectures like FinFET or Gate-All-Around (GAA) Proven record of delivering process solutions in Technology Development (TD) and High Volume Manufacturing (HVM) Cross-functional leadership experience for yield improvement, defect reduction, or technology ramp initiatives Experience mentoring engineers and providing technical guidance Strong ownership mindset with the ability to lead initiatives from concept through implementation For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.

Immigration Sponsorship Information Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. • Job posting details (such as work model, location or time type) are subject to change. • ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.

If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Related roles

Common questions

What is the salary for the Thin Films Module Development Engineer role at Intel?

The listed annual base salary range is $156K–$255K. This figure is taken from the posting itself.

Does Intel sponsor H-1B visas?

Intel has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Thin Films Module Development Engineer role. Confirm with the employer before applying if visa support is required.

Where is the Thin Films Module Development Engineer role at Intel based?

This role is based in Hillsboro, OR.

What degree is required for the Thin Films Module Development Engineer role at Intel?

The posting accepts the following combinations: BS + 6 years, MS + 4 years, PhD + 2 years.

How many years of experience does this Thin Films Module Development Engineer role require?

The posting calls for at least 6 years of relevant experience.

What polymers or materials does this Thin Films Module Development Engineer role work with?

metals thin films.

What techniques or methods are required for this Thin Films Module Development Engineer role?

equipment metrology.