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Module Development Engineer

Intel · Hillsboro, OR,today
$134k – $189k

PhD-level Process Engineering roles on Crosslinked list a median of $154k (26 that show pay).

Develop and optimize semiconductor module processes (thin film, etch, planarization) using DOE, SPC and materials characterization.

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Worth knowing

Why it is interesting. Pathfinding on next-generation device architectures with supplier collaboration and tech transfer to high-volume manufacturing

Deep specialist PhD-friendlyFirst industry role

Adjacent materials role:Process development incl. material selection, thin film deposition, etching, planarization; materials characterization (SEM, TEM, XPS, ellipsometry); PhD in Materials Science

H-1B filings

Intel filed 974 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Process Engineer, Engineering Manager, Quality Reliability Engineer. Median filed pay: $124K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay · Every employer's filings

Seniority
Entry level
Work
Hybrid
Type
Full-time
Degree
PhD
Experience
No minimum
Industry
Semiconductor
Role
Process Engineering
Benefits
stock bonuses

Role details

Job Details: Job Description: The Role and Impact: As a Module Development Engineer, you will spearhead the development and optimization of advanced semiconductor manufacturing processes crucial to delivering Intel's high-performance devices. In this role, you will design experiments, analyze data, and refine process methodologies, ensuring seamless integration and manufacturability. Your work will directly contribute to Intel's leadership in creating cutting-edge device architectures and advancing the semiconductor industry forward. Business Group: Intel Foundry Technology Development is dedicated to delivering world-class manufacturing solutions that power Intel's product innovation.

The team focuses on advancing semiconductor process engineering and enabling the design and production of industry-leading devices. Joining this organization means collaborating in a dynamic environment that supports Intel's continued leadership in the competitive semiconductor market.

Key Responsibilities

Design, execute, and analyze experiments to optimize manufacturing processes for yield, functionality, and efficiency Develop and sustain semiconductor processing techniques, including material selection, equipment optimization, and metrology system design Conduct feasibility studies and pathfinding activities to identify innovative solutions for next-generation device architectures Collaborate with equipment and material suppliers to evaluate, qualify, and integrate novel technology solutions into manufacturing workflows Perform process characterization using Statistical Process Control (SPC), Design of Experiments (DOE), and advanced data analysis tools Partner with cross-functional teams to ensure seamless process integration and manufacturability Support technology transfer to high-volume manufacturing through training, audits, and process consistency across sites Qualifications:

Minimum qualifications

are required to be initially considered for this position.

Preferred qualifications

are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications

PhD in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, Chemistry, or related STEM field 6+ months of experience in one or more of the following: Proficiency in semiconductor manufacturing techniques such as lithography, etching, thin film deposition, or planarization Expertise in process characterization methods and statistical analysis tools like MATLAB, JMP, or Python Familiarity with materials characterization techniques such as SEM, TEM, XPS, or ellipsometry Preferred Qualifications: Experience with advanced device architectures and process integration challenges, such as transistor scaling or selectivity control Hands-on experience with equipment troubleshooting, maintenance, or development alongside suppliers Knowledge of manufacturing technologies including vacuum processes, ALD, or CVD Strong problem-solving skills and the ability to manage multiple tasks in a fast-paced environment Collaborative mindset with a proven track record of working across interdisciplinary teams to achieve shared objectives For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.

Immigration Sponsorship Information Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. • Job posting details (such as work model, location or time type) are subject to change. • ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process.

Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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Common questions

What is the salary for the Module Development Engineer role at Intel?

The listed annual base salary range is $134K–$189K. This figure is taken from the posting itself.

Does Intel sponsor H-1B visas?

Intel has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Module Development Engineer role. Confirm with the employer before applying if visa support is required.

Where is the Module Development Engineer role at Intel based?

This role is based in Hillsboro, OR. Work arrangement: Hybrid.

What degree is required for the Module Development Engineer role at Intel?

This role asks for a PhD.

How many years of experience does this Module Development Engineer role require?

The posting does not ask for prior experience.

What techniques or methods are required for this Module Development Engineer role?

SEM, TEM, XPS, ellipsometry, Statistical Process Control.