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Substrate Process Engineer

Atomica · Goleta, CAtoday
$90k – $140k

BS-level Process Engineering roles on Crosslinked list a median of $114k (687 that show pay).

Develop and sustain wafer bonding, wet etch, electroplating, CMP and dicing processes for MEMS fabrication, improving yield and stability.

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Worth knowing

Why it is interesting. Broad backend process ownership (bonding, plating, CMP, dicing) at a MEMS foundry serving photonics and AI hardware.

Mostly at the benchGeneralist BS acceptable

Adjacent materials roleDevelops wafer bonding (eutectic, thermocompression, adhesive), wet etch, electroplating (Au, Cu, Ni, AuSn), CMP and wafer grinding processes; DOE and SPC

Seniority
Mid-level
Work
On-site
Type
Full-time
Degree
BS
Experience
3+ yrs
Industry
Semiconductor
Role
Process Engineering

Role details

Summary

Atomica is a U.S.-based microfabrication foundry that builds advanced platforms for AI hardware, photonics, sensors, MEMS, and biotechnology devices. Atomica supports customers developing AI optical connectivity, AI optical source integration, photonic integration, thermal microstructures, physical AI sensors, MEMS optical control systems, and biotechnology microdevices with rapid prototyping and scalable production. We are seeking a highly skilled and motivated Substrate Process Engineer with expertise in wafer bonding and high-precision alignment to join our MEMS fabrication team.

This role focuses on developing and sustaining critical wafer-level bonding and alignment processes, such as anodic, fusion, direct, and adhesive bonding, with a strong emphasis on sub-micron to micron-level alignment accuracy required for MEMS device integration. The candidate will work closely with process engineering, integration, and R&D teams to enable reliable and scalable backend processes in a cleanroom manufacturing environment.

Key Responsibilities

Develop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive). Wet etch processes (Si, oxide, metals) including rate and uniformity control. Support electroplating processes (Au, Cu, Ni, NiFe, AuSn). Support Dicing, CMP , wafer Grinding processes.  Improve yield, reduce defects, and optimize process stability. Perform DOE, root cause analysis, and SPC monitoring. Support equipment qualification and uptime. Work closely with R&D, production, and quality teams.

Qualifications

B.S. or M.S. in Engineering (Materials, Chemical, Electrical, Mechanical, or related) 3+ years experience in semiconductor or MEMS fabrication Hands-on experience in at least two of the following: Wafer bonding Wet etching Electroplating CMP or wafer thinning Dicing Why work with us? Atomica is changing the world. Working at Atomica is truly a one-of-a-kind opportunity to impact groundbreaking technology while living in paradise. Your contributions to our MEMS technology will drive innovation, solve the great problems of our time and directly impact the lives of people across the globe. Life in Santa Barbara:   Want to live in paradise? Life in Santa Barbara is just that.

Atomica is sandwiched between the beautiful Santa Ynez mountains and the pristine Central California coastline. The weather? Absolutely gorgeous. No more shoveling snow or hiding from tornadoes! Within 5-minutes from the office, you will find rich local culture, world class schools, airport for convenient travel, festivals, and excellent options to wine and dine. We have had employees move from all over the country and say life has never been better!

Compensation

$90,000-$140,000 *Atomica encourages applications from candidates at all levels where pay will be based on experience.*

Related roles

Common questions

What is the salary for the Substrate Process Engineer role at Atomica?

The listed annual base salary range is $90K–$140K. This figure is taken from the posting itself.

Where is the Substrate Process Engineer role at Atomica based?

This role is based in Goleta, CA.

What degree is required for the Substrate Process Engineer role at Atomica?

This role requires a BS.

How many years of experience does this Substrate Process Engineer role require?

The posting calls for at least 3 years of relevant experience.

What polymers or materials does this Substrate Process Engineer role work with?

silicon, oxide, Au, Cu, Ni.

What techniques or methods are required for this Substrate Process Engineer role?

wafer bonding, wet etching, electroplating, CMP, dicing.