Staff Engineer - Advanced Packaging Multiphysics Physics Modeling
PhD-level R&D / Research roles on Crosslinked list a median of $135k (161 that show pay).
Model multiphysics behavior of advanced packaging, including polymer dielectric and mold compound constitutive modeling.
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Worth knowing
Why it is interesting. Own multiphysics simulation for glass-core and panel-level advanced packaging, closing the loop with physical failure analysis.
Might not be for you. Heavily simulation-focused; limited hands-on lab or formulation work.
Adjacent materials role:Material property characterization and modeling for polymers (dielectrics, mold compounds), metals (Cu, Ti seed), glass/ceramic substrates – CTE mismatch, viscoelasticity
- Seniority
- Staff/Principal
- Work
- On-site
- Type
- Full-time
- Degree
- PhD
- Industry
- Semiconductor
- Role
- R&D / Research
Role details
Role Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling (Mechanical- Electrical Co-Simulation)
Job Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling
Location: Covington, GA
Job Type: Full-Time
Job Description
This role owns the simulation, modeling and interpretation of Multiphysics behavior across advanced packaging architectures from die level interconnects through buildup layers to system-level integration. The engineer will build and validate predictive models for mechanical (stress, warpage, fatigue, delamination, cracking, SeWaRe) and electrical (signal/power integrity, thermal-electrical coupling) performance, translating simulation output into design rules and go/no-go decisions for process and product teams.
Core work spans finite element analysis (FEA) of interlayer/interface stresses, material characterization and constitutive modeling, failure mode prediction (crack initiation, delamination, via cracking, SeWaRe type reliability failures), and RDL/buildup layer mechanical-electrical co-optimization, closing the loop between simulation predictions and physical failure analysis/reliability test data.
Required Skills
- FEA modeling (ANSYS, Abaqus, or COMSOL) for stress/strain, thermos-mechanical and fracture mechanics analysis in multilayer stacks
- Interface/interlayer stress and delamination modeling (cohesive zone modeling, VCCT, traction-separation laws)
- Material property characterization, and modeling for polymers (dielectrics, mold compounds) metals, (Cu, Ti seed), and glass/ceramic substrates – CTE mismatch, viscoelasticity, plasticity
- Working knowledge of RDL buildup layer, and interposer architectures (organic, glass core) and their process induced stress states
- Failure mode analysis tied to package reliability (thermal cycling, SeWaRe, drop/shock, warpage) with ability to correlate simulation to physical failure analysis (SEM, CSAM, cross-section)
- Electrical performance simulation basics – signal/power integrity or coupled electro-thermal-mechanical modeling
- Strong grasp of semiconductor packaging unit processes (lithography, plating, etch) and how they introduce residual stress
- Scripting/automation for parametric studies (Python, MATLAB, or APDL/Abaqus scripting)
- Ability to translate simulation results into actionable design rules for process/product engineering teams
Preferred Skills
- Experience with panel level packaging reliability prediction
- Exposure to system-level (board + package + die) co-simulation
- DOE/Statistical methods for correlating simulation with experimental reliability data
- Familiarity with glass core interposer or 2.5D/3D heterogenous integration mechanics
- Experience with machine learning assisted surrogate modeling for faster design space exploration
Education
- PhD or equivalent industry experience in mechanical engineering materials science, or semiconductor device physics
Benefits
- 401K 6% matching (NO vesting period)
- Healthcare 100% support (Health, Dental, Vision)
- Life, STD, LTD 100 % support
- Cell phone allowance
- PTO and self-development
SALARY
- $90,000 – $150,000
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