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Staff Process Engineer, Advanced Packaging CMP

Micron Technology · Boise, IDtoday

BS-level Process Engineering roles on Crosslinked list a median of $110k (503 that show pay). This posting does not list pay.

Develop and optimize CMP processes for advanced semiconductor packaging at Micron.

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Worth knowing

Why it is interesting. Work on cutting-edge advanced packaging for AI revolution, with hands-on CMP equipment and vendor collaboration.

Might not be for you. Requires 5+ years CMP experience in semiconductor industry; highly specialized.

Bench and deskTechnical lead Senior hires only

Adjacent materials roleCMP process development, polishing slurries, conditioners, polishing pads, dielectrics/metals CMP

H-1B filings

Micron Technology filed 201 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Semiconductor Process Engineer, Equipment Engineer, Fab Engineer. Median filed pay: $118K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority
Senior
Work
On-site
Type
Full-time
Degree
BS
Experience
5+ yrs
Industry
Semiconductor
Role
Process Engineering
Benefits
equity/stock

Role details

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information.

Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements.

Responsibilities

Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate manufacturability of next-generation solutions Incorporate best known manufacturing methods into early development phase of upcoming nodes Design and implement advanced process monitoring and control methodologies Serve in a technical advisory role, contributing to technical projects for improvements to processes, procedures, and equipment Define and lead complex, multi-functional projects of critical importance to Micron, helping to define strategic direction Provide advice and counsel to management on significant technical issues; Lead and initiate innovation projects through patents/technical papers Using AI to improve job functions Minimum Qualifications: BS or MS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry or Physics with 5+ years of experience in Chemical Mechanical Planarization (CMP) within the semiconductor industry Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads Experience in dielectrics/metals CMP process development on Advanced Packaging or other semiconductor technologies Understanding of various integration/structural impacts and constraints related to film deposition and other upstream/downstream processes Excellent oral and written communication skills with ability to convey messaging and technical concepts in concise and effective manners Preferred Qualifications: PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry or Physics plus 3+ years of relevant experience Skills in data science, modelling, and experience/an interest in leveraging AI to optimize workflows A specialized background in 300mm wafer fabrication As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here.

To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [email protected] or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials.

However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Related roles

Common questions

Does Micron Technology sponsor H-1B visas?

Micron Technology has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Staff Process Engineer, Advanced Packaging CMP role. Confirm with the employer before applying if visa support is required.

Where is the Staff Process Engineer, Advanced Packaging CMP role at Micron Technology based?

This role is based in Boise, ID.

What degree is required for the Staff Process Engineer, Advanced Packaging CMP role at Micron Technology?

The posting accepts the following combinations: BS + 5 years, MS + 5 years, PhD + 3 years.

How many years of experience does this Staff Process Engineer, Advanced Packaging CMP role require?

The posting calls for at least 5 years of relevant experience.

What polymers or materials does this Staff Process Engineer, Advanced Packaging CMP role work with?

polishing slurries, polishing pads, dielectrics, metals.

What techniques or methods are required for this Staff Process Engineer, Advanced Packaging CMP role?

optical metrology, profilometry, failure analysis, FMEA, SPC/FDC.