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Mechanical Reliability Intern - Summer 2027

Corning · Corning, NYtoday
$1,635 – $3,185/wk

MS-level Quality / Testing roles on Crosslinked list a median of $121k (13 that show pay).

Test and characterize brittle thin glass materials for reliability using ring-on-ring, four-point bend, DIC and failure analysis.

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Worth knowing

Why it is interesting. Hands-on ring-on-ring, four-point bend and DIC testing on thin glass at a leading glass and ceramics innovator

Might not be for you. Glass and brittle-materials focus, not polymers; no visa sponsorship

Mostly at the benchHands-on execution Internship-friendly

Core polymer roleReliability study of brittle materials: Ring on Ring, Four Point Bend, DIC, failure mode analysis, characterize glass-based multi-material systems, Weibull analysis

Seniority
Intern/Co-op
Work
On-site
Type
Internship
Degree
MS
Experience
0+ yrs
Industry
Electronics
Role
Quality / Testing
Visa
No sponsorship
Materials
thin glass1 rolebrittle glass-based multi-material systemsceramics183 roles
Benefits
housing and travel assistanceweekly tech talks

Role details

Requisition Number: 79342 The company built on breakthroughs. ​ Join us.​ Corning is one of the world’s leading innovators in glass, ceramic, and materials science. From the depths of the ocean to the farthest reaches of space, our technologies push the boundaries of what’s possible. ​ How do we do this? With our people. They break through limitations and expectations – not once in a career, but every day. They help move our company, and the world, forward. ​ ​ At Corning, there are endless possibilities for making an impact. You can help connect the unconnected, drive the future of automobiles, transform at-home entertainment, and ensure the delivery of lifesaving medicines.

And so much more.​ ​ Come break through with us. Role Purpose The Summer 2027 Mechanical Testing intern will support a reliability study of brittle materials. The study will focus on component level testing including Ring on Ring, Four Point Bend, Digital Imaging Correlation (DIC) and Failure Mode Analysis. Under the guidance of technical staff, the intern will review literature, characterize materials, support reliability testing, develop hypotheses, and correlate observed behavior with measured materials.

Program Perks: Competitive salaries Assistance with housing and travel Meaningful project and final project presentation Intern Activities: Social and networking opportunities Weekly tech talks Community involvement Key Responsibilities Conduct component level testing on mechanically advantaged thin glass materials. Conduct DIC on system-level consumer electronic products as well as pucks. Analyze strain data and stress data. Design and execute experiments. Characterize brittle, glass-based multi-material systems using available laboratory methods and accurately document the results. Support reliability testing and conduct Failure Mode Analysis.

Experiences/Education - Required Currently pursuing an advanced degree in mechanical engineering, materials engineering, or a closely related field. Experience with debugging of mechanical test methodologies with attention to detail. Ability to follow laboratory safety procedures, experimental protocols, and data-documentation practices. Strong analytical and problem-solving skills, with attention to detail and a willingness to learn hands-on laboratory techniques. Ability to organize, analyze, and communicate experimental results clearly in written and verbal formats. Ability to work collaboratively with scientists and engineers while independently completing assigned tasks.

Experiences/Education - Desired Familiarity with DIC (Digital Imaging Correlation). Experience with materials characterization or mechanical testing, mechanics of materials, strength testing and Weibull analysis. Optical microscopy. Familiarity with experimental design and data analysis. Experience using spreadsheets, data-analysis tools, organize and analyze experimental data. Knowledge of experimental mechanics of brittle materials, including glasses or ceramics. This position does not support immigration sponsorship. ​The range for this position is $1,635.00 - $3,185.00 biweekly.

Starting pay for the successful applicant is prescribed based on geographic location, nature of position, and year in school. A job that shapes a life. We prohibit discrimination on the basis of race, color, gender, age, religion, national origin, sexual orientation, gender identity or expression, disability, veteran status or any other legally protected status. Corning is committed to providing equal employment opportunities and considers requests for reasonable accommodations in accordance with applicable laws.

Individuals with disabilities or sincerely held religious beliefs may request reasonable accommodations to participate in the application or interview process, perform essential job functions, or access other benefits and privileges of employment. To submit a request for reasonable accommodation related to disability or religion, please contact us at [email protected] .

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Common questions

What is the salary for the Mechanical Reliability Intern - Summer 2027 role at Corning?

The listed annual base salary range is $43K–$83K. This figure is taken from the posting itself.

Does Corning sponsor work visas for the Mechanical Reliability Intern - Summer 2027 role?

This employer will not provide visa sponsorship for this role.

Where is the Mechanical Reliability Intern - Summer 2027 role at Corning based?

This role is based in Corning, NY.

What degree is required for the Mechanical Reliability Intern - Summer 2027 role at Corning?

This role requires a MS.

How many years of experience does this Mechanical Reliability Intern - Summer 2027 role require?

The posting calls for at least 0 years of relevant experience.

What polymers or materials does this Mechanical Reliability Intern - Summer 2027 role work with?

thin glass, brittle glass-based multi-material systems.

What techniques or methods are required for this Mechanical Reliability Intern - Summer 2027 role?

Ring on Ring testing, Four Point Bend, Digital Image Correlation, Failure Mode Analysis.