Plasma/Dry Etch Manufacturing Process Engineer (DMOS6)
BS-level Process Engineering roles on Crosslinked list a median of $115k (783 that show pay). This posting does not list pay.
Improve and support plasma/dry etch processes in a 300mm analog wafer fab, running process experiments and dispositioning lots and equipment.
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Worth knowing
Why it is interesting. Hands-on etch process ownership in a high-volume 300mm fab, including ramp support and process experiments
Might not be for you. Supports 24/7 manufacturing, so the work is production-focused rather than open-ended materials R&D
Adjacent materials roleDry/plasma etch process engineer in a 300mm wafer fab: process experiments, yield and quality improvement; materials science degree accepted
H-1B filings
Texas Instruments filed 38 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.
Most common titles: Validation Engineering Manager, Analog Design Manager, Digital Design Manager. Median filed pay: $166K a year.
From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings
- Seniority
- Mid-level
- Work
- On-site
- Type
- Full-time
- Degree
- BS
- Experience
- 2+ yrs
- Industry
- Semiconductor
- Role
- Process Engineering
Role details
Change the world. Love your job. Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated engineer to join our team.
The responsibilities of a Manufacturing Process Engineer in this role include: Support 24/7 manufacturing operations Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs) Participate in data analysis and problem resolution Minimum requirements: 2 years of experience in the Semiconductor Industry as a Dry/Plasma etch process engineer.
Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field. Strong foundation in statistical process control, engineering change control and process release strategies.
Preferred qualifications
Demonstrated strong analytical and problem solving skills Strong verbal and written communication skills Ability to work in teams and collaborate effectively with people in different functions Strong time management skills that enable on-time project delivery Demonstrated ability to build strong, influential relationships Ability to work effectively in a fast-paced and rapidly changing environment Ability to take the initiative and drive for result
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