Does Quantum Computing Inc. (NHanced Semiconductors) sponsor work visas for the Chemical Mechanical Planarization Engineer role?

This role requires US citizenship — not just permanent residency.

Where is the Chemical Mechanical Planarization Engineer role at Quantum Computing Inc. (NHanced Semiconductors) based?

This role is based in Odon, IN.

How many years of experience does this Chemical Mechanical Planarization Engineer role require?

The posting calls for at least 3 years of relevant experience.

One of 6,545 open polymer and materials roles on Crosslinked, each read for materials, degree, visa and salary. See roles like this

Chemical Mechanical Planarization Engineer

Quantum Computing Inc. (NHanced Semiconductors) · Odon, INtodayverified 2 h ago

BS-level Process Engineering roles on Crosslinked list a median of $113k (710 that show pay). This posting does not list pay.

Develop and optimize CMP processes for advanced semiconductor packaging, running DOEs, qualifying equipment, and reducing defects.

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Worth knowing

Why it is interesting. Foundational member of a growing CMP organization supporting TSV and RDL advanced packaging with planned site expansion.

Might not be for you. US citizenship required, remote Odon, IN onsite cleanroom role with no relocation mentioned.

Mostly at the benchDeep specialist BS acceptable

Adjacent materials roleDevelop, optimize and sustain Chemical Mechanical Planarization (CMP) processes; DOE, SPC; semiconductor materials and fabrication processes

Seniority: Mid-level
Work: On-site
Type: Full-time
Degree: BS
Experience: 3+ yrs
Industry: Semiconductor
Role: Process Engineering
Schedule: Standard
Visa: US citizenship required

Materials

semiconductor materials23 roles

Techniques

DOE271 roles SPC296 roles

Role details

Position Title: CMP Engineer

Location: Odon IN

Job Type: Permanent, Full-time, Onsite

FLSA Status: Exempt: (US Citizen Required)

Position Summary

Quantum Computing Inc. (QCi) NHanced Semiconductors is seeking an experienced

Chemical Mechanical Planarization (CMP) Engineer

to support process development and manufacturing operations within our advanced semiconductor packaging environment. This role will be responsible for developing and optimizing CMP processes, executing design of experiments (DOE), qualifying equipment, improving yields, and reducing process defects.

The ideal candidate will bring hands-on CMP experience and a strong understanding of semiconductor manufacturing processes. This individual will collaborate closely with Process Integration, Equipment Engineering, and Metrology teams to drive process performance and support the growth of NHanced's expanding semiconductor operations.

Key Responsibilities

Develop, optimize, and sustain Chemical Mechanical Planarization (CMP) processes.
Design and execute experiments (DOE) to improve process capability, yield, and performance.
Qualify new equipment, materials, and process changes.
Monitor process performance and implement corrective actions to reduce defects and variability.
Utilize Statistical Process Control (SPC) methodologies to maintain process health.
Analyze process data and prepare technical reports and recommendations.
Partner with Process Integration, Equipment Engineering, and Metrology teams to support product and technology development.
Drive continuous improvement initiatives related to throughput, yield, and process reliability.
Maintain ownership of assigned CMP equipment and support long-term process roadmap initiatives.

Qualifications

Required

Bachelor's degree in Engineering, Materials Science, Chemistry, Physics, or a related technical discipline.
Minimum of 3 years of direct Chemical Mechanical Planarization (CMP) experience in a semiconductor manufacturing environment.
Strong understanding of semiconductor materials and fabrication processes.
Experience developing and executing Design of Experiments (DOE).
Experience with Statistical Process Control (SPC) and data-driven process optimization.
Experience qualifying process equipment and implementing process improvements.
Strong analytical, troubleshooting, and problem-solving skills.
Excellent communication and collaboration abilities.

Preferred

Experience supporting advanced packaging technologies.
Knowledge of Through-Silicon Via (TSV) processing.
Knowledge of Redistribution Layer (RDL) technologies.
Experience working in high-volume semiconductor manufacturing environments.
Experience with root cause analysis and yield improvement initiatives.
Experience collaborating with Process Integration, Equipment Engineering, or Metrology teams.

Why Join Us?

Be a foundational member of a growing CMP organization.
Support a rapidly expanding semiconductor manufacturing site with significant planned growth initiatives.
Work on advanced semiconductor packaging technologies alongside a multidisciplinary engineering team.
Gain opportunities for career growth into technical leadership, people leadership, or process integration engineering roles.

Work Environment

Full-time onsite position located in Odon, Indiana.
Standard Monday-Friday schedule.
Work performed in a semiconductor cleanroom environment.
Requires the use of cleanroom garments and personal protective equipment.
May occasionally lift and transport wafer carriers and related materials.

*Quantum Computing Inc. (QCi) is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or any other characteristic protected by applicable federal, state, or local law.*

*Incumbent(s) in this position may be required to perform other duties and special assignments not specifically stated above. Statements outlined in this section are designated as essential job functions in accordance with the Americans with Disabilities Act of 1990.*