Senior Process Engineer - Deposition
BS-level Process Engineering roles on Crosslinked list a median of $114k (687 that show pay). This posting does not list pay.
Develop and sustain thin-film deposition processes and troubleshoot vacuum tools for semiconductor microfabrication.
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Worth knowing
Why it is interesting. Broad deposition toolset (sputtering, IBD, ALD, PECVD) with end-to-end ownership of new process and tool development across 20+ programs
Might not be for you. Requires 5+ years in semiconductor fab manufacturing and hands-on vacuum hardware troubleshooting
Adjacent materials roleDesign recipes for new thin-film applications meeting required mechanical, optical and electrical material properties; PVD/CVD/ALD deposition; DOE
- Seniority
- Senior
- Work
- On-site
- Type
- Full-time
- Degree
- BS
- Experience
- 5+ yrs
- Industry
- Semiconductor
- Role
- Process Engineering
Role details
Summary Atomica is seeking a driven Process Engineer to join our Surface Engineering, with a primary focus on deposition. We are looking for someone who can support existing production processes and develop processes for new programs (20+) focusing on product quality and manufacturability. Collaboration is a must as you work closely with the integration, manufacturing engineering, maintenance and production teams on development of new processes, sel ection of new equipment/technology, standardization and problem resolution. This role is designed for a technical leader who thrives at the intersection of advanced materials and complex vacuum hardware. Primary Responsibilities 1.
New Process & Tool Development End-to-End Development: Design and execute recipes for new thin-film applications, ensuring strict adherence to required material properties (mechanical, optical and electrical characteristics). Integration Collaboration: Partner with the integration team to ensure surface engineering solutions meet fu nctional requirements for complex devices Tool Qualification: Lead the technical evaluation, installation, and testing of new capital equipment to meet production-ready standards. DOE & Optimization: Design and execute Design of Experiments (DOE) to determine process windows and optimize results.
Strong fundamentals in data analysis and demonstrated critical thinking skills 2. Advanced Troubleshooting & Root Cause Analysis Early-Stage & Production Support: Identify and resolve fundamental process instabilities during early-stage R&D while maintaining the discipline to lead "Task Force" efforts for chronic production excursions. Hardware-Process Mastery: Act as the primary technical expert for resolving complex process-hardware interactions. Tool Troubleshooting: Help perform diagnostics on vacuum systems, RF power delivery, and gas flow controllers. Hands-on experience is highly valued. 3.
Sustaining & Standardization Statistical Process Control (SPC): Implement and monitor SPC charts in JMP to identify trends, prevent excursions, and ensure long-term process stability. Standardization: Author and maintain high-quality Standard Operating Procedures and technical documentation to ensure cross-shift consistency. Technical Expertise Preferred Deposition (Primary Focus) PVD: Experience with RF, DC, and Pulsed DC Magnetron Sputtering, Ion Beam Deposition (IBD) and E-beam evaporation CVD & ALD: Deep knowledge of PECVD, HDPCVD, ALD, and LPCVD. Thermal: Proficiency in oxidation furnaces, annealing, and RTP/RTA.
Dry Etch & Clean Plasma Processing: Hands-on experience with Bosch process (DRIE), dielectric etching, plasma ashing, and Ion Beam Etching (IBE)
Required Qualifications
B.S., M.S., or Ph.D. in Materials Science, Electrical Engineering, Physics, or other engineering discipline. 5+ years of experience in a semiconductor microfabrication manufacturing environment. Deep understanding of material properties and the specific process knobs required to obtain them. Expert-level proficiency in JMP for data analysis, statistical modeling, and DOE. Proven track record of "hands-on" hardware troubleshooting. Ability to diagnose mechanical, electrical, and vacuum-related failures.
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