GaN Photo Manufacturing Process Engineer (SM1)
BS-level Process Engineering roles on Crosslinked list a median of $115k (792 that show pay). This posting does not list pay.
Develop and improve GaN fab photolithography processes, including resist chemistry and ARC film stacks, and resolve yield excursions.
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Worth knowing
Why it is interesting. Work on resist chemistry and film stack optimization for GaN-on-Si HEMT devices in a ramping fab.
Might not be for you. Fab process-engineering role focused on yield and excursions, not open-ended materials R&D.
Adjacent materials roleDrive lithography process incl. resist chemistry, anti-reflective coatings, and film stack interactions; qualify new/enhance existing photo processes
H-1B filings
Texas Instruments filed 38 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.
Most common titles: Validation Engineering Manager, Analog Design Manager, Digital Design Manager. Median filed pay: $166K a year.
From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings
- Seniority
- Mid-level
- Work
- On-site
- Type
- Full-time
- Degree
- BS
- Experience
- 2+ yrs
- Industry
- Semiconductor
- Role
- Process Engineering
Role details
Change the world. Love your job. Texas Instruments is looking for an energetic engineer with a passion for process. This position reports to the DAP (Diffusion, AMHS, and Photo) PE Section manager at SMFAB and provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated engineer to join our team.
The responsibilities of a Photo Process Engineer in this role include: Support manufacturing operations and new process development Provide manufacturing capacity and diversify the product portfolio by qualifying new / enhancing existing processes in a ramping-fab environment Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality Drive cost-competitive strategies for the lithography process including, but not limited to, resist chemistry, anti-reflective coatings, and film stack interactions Lead root-cause investigations for excursions or yield issues Identify systematic problems in either process or equipment-related sources and communicate findings to the engineering staff in a continuous manner Primary role in data analysis and problem resolution Minimum requirements: Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field 2 years of experience as a Photolithography Process Engineer Preferred qualifications: Experience with GaN-on-Si in a semiconductor environment, including HEMT structures, device physics, and GaN applications Knowledge of critical dimension (CD) control, overlay, focus/exposure matrix (FEM) optimization, and OPC (optical proximity correction) Proficient in Microsoft Office software tools Excellent people skills with the ability to communicate at all levels, influence others within and across teams, and relate to individuals from various backgrounds, experiences, and skills Ability to take the initiative, drive for results and proactively prevent counterproductive manufacturing events Demonstrate ability to identify and resolve manufacturing problems using a systematic approach Strong verbal and written communication skills Demonstrated strong analytical and problem-solving skills Strong experience with process control systems (SPC), APC (advanced process control), and equipment matching Strong time management skills that enable on-time project delivery Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment Demonstrated ability to build strong, influential relationships
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