Microwave Bonding Technician II - Weekend Nights
Fabricate and bond microwave/RF microelectronic modules using adhesives, epoxies and die attach.
Worth knowing
Why it is interesting. Hands-on microelectronics assembly for electronic warfare hardware, with a 15% night-shift premium and 40 hours paid for 36 worked.
Might not be for you. Weekend night shift (Fri-Sun 3PM-3AM) and production-focused bonding work rather than open-ended R&D.
Adjacent materials rolesubstrate attach (duroid/ceramic), MMICs, IC's... eutectic die attach... lamination presses... sheet epoxies... wide variety of adhesives and epoxy
- Seniority
- Technician
- Work
- On-site
- Type
- Full-time
- Industry
- Defense
- Role
- Manufacturing / Production
- Schedule
- Night shift
Role details
Please note this position supports our Weekend Night Shift working Friday, Saturday and Sunday from 3PM to 3AM. You will work 36 Hours and be paid for 40 Hours plus earn a 15% pay premium. See what you’re missing. Our employees work on the world’s most advanced electronics – from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we are developing the technology of tomorrow, delivered today. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life.
We put our customers first – exemplified by our mission: “We Protect Those Who Protect Us®.” Sound like a team you want to be a part of? Come build your career with BAE Systems. Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safely. We are seeking a Microwave Technician for our 8th shift manufacturing team.
Key Roles and Responsibilities include: Fabricating and/or modifying complex micro-integrated circuit modules or microwave/RF integrated circuit modules and sub-assemblies by following specific instructions, such as for wire and ribbon bonding utilizing various manual and automatic bonding machines or using an MRSI microwave component automated pick and place machine Must be able to perform substrate attach (duroid/ceramic), MMICs, IC's, caps, diodes and resistors, soldering skills and eutectic die attach Must be able to work with lamination presses, bladder bag ovens and sheet epoxies (mainly with the focus of attaching substrates to modules/housings) Must be able to work with a wide variety of adhesives and epoxy