Lead Reliability Engineer, Advanced Packaging

Role details

We are seeking a highly skilled Lead Reliability Engineer to join as the reliability architect for complex power-module and advanced-packaging platforms.

This role will lead reliability strategy from concept through qualification and product release, translating customer use conditions and mission profiles into design-for-reliability requirements, characterization plans, and qualification strategies. • Own the reliability strategy for complex power-module and advanced-packaging platforms, including die, interconnect, package, materials, and assembly-process qualification for high-power applications. • Translate customer use conditions, system mission profiles, and application requirements into measurable reliability targets, acceleration models, stress conditions, and qualification plans. • Apply physics-of-failure and design-for-reliability methods to identify critical failure mechanisms, define reliability margins, and influence design and material selections early in development. • Develop and deploy best-in-class reliability test and characterization methods, including appropriate electrical, thermal, mechanical, environmental, and power-cycling stresses. • Own reliability test planning and execution, including sample strategy, test conditions, acceptance criteria, schedules, logistics, data quality, and risk-based prioritization. • Use statistical methods to analyze reliability data, establish confidence in conclusions, and support lifetime or degradation modeling where applicable. • Partner with cross-functional teams to develop characterization routines and qualification strategies for New Technology Development and New Product Development (NPD). • Lead investigation and technical closure of reliability failures through structured failure analysis, root-cause determination, corrective actions, and validation of effectiveness. • Maintain clear qualification status, risk registers, decision points, and escalation paths; communicate technical conclusions and residual risks to customers and executive stakeholders. • Serve as a key quality and reliability interface with customers during product development, qualification, and issue resolution. • Provide technical leadership and mentoring to engineers and cross-functional teams on reliability methods, standards, and problem solving. • Manage multiple concurrent qualification and characterization programs while meeting project commitments and maintaining technical rigor.

Minimum requirements: Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or a related technical field; Master's degree or PhD preferred. 8+ years of relevant experience in semiconductor, power-electronics, packaging, or product reliability, including leadership of complex qualification or reliability programs. Demonstrated experience with die- and package-level reliability, advanced packaging, power modules, and associated failure mechanisms. Strong knowledge of reliability test methods, acceleration principles, qualification planning, and industry standards such as JEDEC, AEC-Q, and AQG 324, as applicable.

Experience translating customer use conditions or system mission profiles into reliability requirements and validation plans. Working knowledge of statistical analysis and reliability methods using JMP, ReliaSoft, Minitab, Python, or equivalent tools. Experience leading cross-functional problem solving, failure analysis, root-cause investigations, corrective actions, and technical risk assessments. Excellent written and verbal communication skills, including the ability to present complex technical topics, qualification status, and risk trade-offs to customers and executive stakeholders.

Demonstrated ability to manage multiple priorities and deliver high-quality results in a fast-paced development environment. Ability to travel within the United States and internationally, as required.

Preferred qualifications

Experience with high-power semiconductor devices and modules, including Si, IGBT, SiC, or GaN technologies. Experience with thermal-mechanical reliability, interconnect reliability, power cycling, temperature cycling, humidity-bias testing, and lifetime modeling. Experience supporting automotive or industrial customers and working within structured product-development and change-control processes. Experience developing new test methods or test vehicles where existing industry-standard methods are insufficient.