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3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate)

GlobalFoundries · Malta, NY1mo agoverified 1 h ago
$65k – $146k

MS-level R&D / Research roles on Crosslinked list a median of $137k (88 that show pay).

Own 3DHI design manual specs and test vehicles for advanced packaging R&D at a 300mm fab

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Worth knowing

Why it is interesting. Sits between unit process R&D and PDK/design teams on wafer-to-wafer bonding, TSV and interposer development at a leading foundry.

Might not be for you. Design-enablement/documentation heavy rather than hands-on materials R&D; entry-level new-college-grad pipeline role.

Mostly desk workGeneralist PhD-friendlyFirst industry roleBS acceptable Realistic requirements

Adjacent materials role3D heterogeneous integration design enablement: wafer-to-wafer bonding, die-to-wafer bonding, TSV/TOV and interposer development; MS in Materials Science

H-1B filings

GlobalFoundries filed 58 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Sr Engineer Process Engineering, Sr Engineer Integration Engineering, Principal Eng Equipment Engineering. Median filed pay: $102K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority
Entry level
Work
On-site
Type
Full-time
Degree
MS
Experience
0+ yrs
Industry
Semiconductor
Role
R&D / Research

Role details

About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com . Summary of Role: GlobalFoundries Fab8 is seeking a motivated R&D design enablement engineer to become part of our state-of-the-art 300mm fabrication facility in Malta, New York .

This role will entail 3D heterogeneous integration (3DHI) design enablement to enable our next-generation advanced packaging R&D efforts, which include wafer - to - wafer bonding, die - to - wafer bonding , TSV/TOV and interposer development. Essential Responsibilities: P ublish D esign M anual (DM) specifications based on failure modes identified for packaging required by the product lines in partnership with the unit process and R&D engineers. DM is a collection of all technology restrictions (geometry rules, electrical rules, etc.) that must be followed for an integrated circuit (IC) design to be manufacturable.

Advanced packaging liaison to the DM and PDK ( Process D esign K it) teams to translate packaging requirements to a device enabl e ment specification covering: design rules , library device ( TSV) layouts, layout vs schematic( LVS) requirements , device model terminals. Develop expertise in drafting test vehicle content specifications and the associated tapeout process (including mask reviews ). Develop expertise in drafting test specifications for test vehicle content (macros); engage with the test teams (inline and lab) to ensure alignment on test requests. Collaborate with vendors and OSATs (Outsourced Assembly and Test) on design (test vehicles, masks).

Facilitate a dvanced p ackaging design interactions between the product lines/ fab teams and customers. Work and collaborate with other teams regarding different assignments as needed. Other Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Other duties as assigned by manager.

Required Qualifications

Education – PhD with completed defended thesis or Master's in Electrical Engineering and Materials Science or related field from an accredited degree program.

Must have

at least an overall 3.0 GPA and proven good academic standing. Language Fluency - English (Written & Verbal). Travel - Up to 1 0%.

Preferred Qualifications

Prior-relat ed internship or co-op experience in design or EDA/design enablement Fundamental knowledge of semiconductor packaging process modules and integration. Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. Strong written and verbal communication skills . Strong planning & organizational skills. #NC GProgramUS Expected Salary Range $65,400.00 - $145,800.00 The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address. An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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Common questions

What is the salary for the 3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate) role at GlobalFoundries?

The listed annual base salary range is $65K–$146K. This figure is taken from the posting itself.

Where is the 3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate) role at GlobalFoundries based?

This role is based in Malta, NY.

What degree is required for the 3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate) role at GlobalFoundries?

The posting accepts the following combinations: MS + 0 years, PhD + 0 years.

How many years of experience does this 3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate) role require?

The posting calls for at least 0 years of relevant experience.