Director, Laser Technology
MS-level Management / Director roles on Crosslinked list a median of $180k (13 that show pay). This posting does not list pay.
Lead laser process development and optics team scaling ultrafast laser slicing and dicing of diamond wafers to production.
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Worth knowing
Why it is interesting. Own the laser roadmap for slicing diamond wafers, a rare hard-material semiconductor process scaling to production.
Might not be for you. Optics and photonics leadership role; materials science is secondary and 8+ years laser experience is required.
Adjacent materials roleLaser-material processing of diamond wafers: ultrafast laser slicing, dicing, singulation, surface ablation; Materials Science PhD accepted; laser-material interaction
H-1B filings
Diamond Foundry filed 4 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.
Most common titles: Sr. Mechanical Systems Engineer- Automation, Senior Mechanical Engineer, Principal Process Engineer. Median filed pay: $151K a year.
From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings
- Seniority
- Director+
- Work
- On-site
- Type
- Full-time
- Degree
- MS
- Experience
- 8+ yrs
- Industry
- Semiconductor
- Role
- Management / Director
Role details
We are seeking an experienced, seasoned leader of Laser Technology to lead our laser process development and advanced optics team. In this role, you will own the end-to-end lifecycle of our high-power laser technology —from initial optical physics R&D and beam delivery modeling to scaling laser-material processing loops on the manufacturing floor. You will manage a team of laser engineers, optical physicists, and process specialists driving breakthrough yields in precision material processing.
Key Responsibilities
- Own the technical roadmap for high-power laser systems, beam shaping optics, and ultrafast laser slicing for diamond wafers. - Lead and scale a high-performing team of photonics engineers, optical physicists, and laser process specialists. - Drive the scaling and transfer of laser-material processing recipes (dicing, singulation, surface ablation) from R&D to the factory floor. - Partner with Equipment Engineering to design, procure, and integrate high-precision optical delivery hardware and galvo systems. - Maximize diamond wafer yield by resolving complex laser-material interaction excursions, thermal lens effects, and beam drift - Collaborate with Metrology and Automation teams to implement real-time optical sensor grids and closed-loop process controls.
Qualifications & Experience - Master’s or Ph.D. in Optics, Photonics, Physics, Electrical Engineering, or Materials Science. - 8+ years in laser systems engineering, with 5+ years managing technical optical/process engineering teams. - Deep technical expertise in high-power industrial lasers (fiber, DPSS, ultrafast/femtosecond), beam delivery optics, and galvo scanners. - Proven track record in precision laser-material processing loops (e.g., semiconductor wafer slicing, ceramic/hard-material dicing, or optical annealing). - Proficiency with optical simulation tools (Zemax, Code V) and multiphysics modeling platforms (COMSOL, MATLAB, Python). - Strong background in Statistical Process Control (SPC), Design of Experiments (DOE), and Root Cause Analysis (RCA).
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