Process Development Engineer Intern - DLP
BS-level Process Engineering roles on Crosslinked list a median of $115k (783 that show pay). This posting does not list pay.
Develop MEMS wafer fab processes and characterize new thin film materials for DLP micromirror devices.
Weekly, free, one-click unsubscribe.
Worth knowing
Why it is interesting. Hands-on with SEM, AFM, and ellipsometry while developing thin films for high-volume DMD manufacturing
Might not be for you. Yield and test data analysis focus rather than pure materials research
Adjacent materials roleIdentification and characterization of new thin films materials; thin film deposition, photolithography, etch; SEM, ellipsometry, AFM characterization
H-1B filings
Texas Instruments filed 38 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.
Most common titles: Validation Engineering Manager, Analog Design Manager, Digital Design Manager. Median filed pay: $166K a year.
From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings
- Seniority
- Intern/Co-op
- Work
- On-site
- Type
- Internship
- Degree
- BS
- Experience
- 0+ yrs
- Industry
- Semiconductor
- Role
- Process Engineering
Role details
Change the world. Love your job. Texas Instruments is seeking a Process Development Engineering Intern within the DLP® Products MEMS Development group. We work to define and develop the next generation manufacturing processes for Digital Micromirror Devices (DMD) and Micro Electro Mechanical Systems (MEMS). Our team uses standard semiconductor wafer fabrication methods such as photolithography, etch, and thin film deposition for high volume MEMS manufacturing. The process development engineer works closely with design, characterization, and test teams to play a key role in ensuring the yield and reliability of new products.
The role includes activities such as: Design of experiments to establish new manufacturing methods and process recipes, Use of process characterization tools such as scanning electron microscopy, ellipsometry, atomic force microscopy, and interferometry, Identification and characterization of new thin films materials, Data analysis for process and test yield improvement, Working within the team to drive the necessary actions to meet the yield and reliability needs for the technology. Minimum requirements: Currently pursuing a Bachelor’s degree in areas such as Physics, Materials Science, Electrical Engineering, Chemistry, Optoelectronics or related engineering degree.
Cumulative 3.0/4.0 GPA or higher Preferred qualifications: Strong background in semiconductor processing and characterization methods Basic understanding of operation and fabrication methods for MEMS Strong verbal and written communication skills Ability to work in teams and collaborate effectively with people in different functions Ability to take the initiative and drive for results
Related roles
- LT Specialist Material Process EngineerL3Harris Technologies · Mason, OH
- LT Sr. Specialist, Manufacturing EngineerL3Harris Technologies · Tempe, AZ
- KT Mixing Color Match (2174)KURZ Transfer Products · Huntersville, NC
- NO Lead OperatorNovolex · Villa Rica, GA $41k – $56k
- MT ATE Process EngineerMicron Technology · Boise, ID