Section Manager - Process Development (SM1)
BS-level Management / Director roles on Crosslinked list a median of $180k (115 that show pay). This posting does not list pay.
Lead a team of process engineers developing advanced analog semiconductor process modules and technology programs.
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Worth knowing
Why it is interesting. Oversee all major process modules across concurrent technology programs in 300mm fabs.
Might not be for you. Management-heavy; little hands-on materials work and 5+ years of team leadership required.
Adjacent materials roleLead process development across Photolithography, CVD, PVD, Diffusion, Plasma Etch, CMP; Materials Science listed as qualifying degree
H-1B filings
Texas Instruments filed 38 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.
Most common titles: Validation Engineering Manager, Analog Design Manager, Digital Design Manager. Median filed pay: $166K a year.
From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings
- Seniority
- Manager
- Work
- On-site
- Type
- Full-time
- Degree
- BS
- Experience
- 5+ yrs
- Industry
- Semiconductor
- Role
- Management / Director
Role details
Why Texas Instruments At Texas Instruments, we design and manufacture semiconductors that power electronics across the world. Our 300mm manufacturing facilities represent some of the most advanced wafer fabrication environments in the industry. We invest in our people, our technology, and our manufacturing capabilities and we are looking for leaders who want to make a meaningful impact at scale.
About the Role
Texas Instruments is seeking a technically strong and highly motivated Section Manager - Process Development to lead a cross-functional team of experienced process engineers developing TI's most advanced analog semiconductor technologies. In this leadership role, you will drive innovative process development across all process modules, manage concurrent technology programs, and deliver solutions that push the boundaries of analog technology performance. This is a high-visibility position requiring both deep technical expertise and strong people leadership.
You will partner closely with integration, device, design, and manufacturing teams to define and execute process development strategies delivering results on aggressive timelines in a fast-paced, high-impact environment.
What You'll Do
Team Leadership & Organization Management Lead, develop, and grow a cross-functional team of experienced process engineers spanning all major process modules Drive workforce planning, performance management, succession planning, and talent development within the section Foster a culture of technical excellence, innovation, accountability, and continuous improvement Advanced Process Development Lead process development and optimization across all process modules including Photolithography, CVD, PVD, Diffusion, Plasma Etch, CMP, and other relevant unit processes Define and execute process integration strategies for TI's most advanced analog technology nodes Drive innovative process solutions that meet performance, reliability, and manufacturability requirements Own technical problem-solving and root cause resolution for complex, cross-module process challenges Program Execution & Timeline Management Enable multiple concurrent technology development programs, balancing resources and priorities to meet aggressive milestones Support program schedules, clearly communicating status, risks, and mitigation plans to site and executive leadership Drive cross-functional execution across process engineering, integration, device engineering, equipment, and operations teams to ensure on-time technology delivery Develop scalable engineering workflows and operational frameworks that improve program velocity and team effectiveness Cross-Functional Collaboration & Executive Engagement Partner with integration, yield, device, and operations teams to ensure seamless technology transfer and process readiness Provide regular program updates, technology development status, and risk assessments to site leadership Represent the section in cross-site and corporate-level technology forums, benchmarking activities, and best-practice sharing initiatives Minimum requirements: Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field.
5 years of direct engineering team leadership or management experience within the semiconductor industry.
Preferred qualifications
Broad process module experience spanning multiple unit process areas within an advanced wafer fabrication environment Experience leading technology development for analog, mixed-signal, or specialty semiconductor technologies Familiarity with process integration and technology transfer to high-volume manufacturing Track record of delivering new technology nodes or process generations on schedule and to performance specifications Experience in 300mm wafer fabrication environments Experience supporting multi-site or corporate-level technology benchmarking and governance Strong cross-functional collaboration, communication, and project management skills Proven ability to engage and present program and technology updates to site and executive leadership
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