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Mechanical Engineer

KYOCERA SLD Laser, Inc. · Tucson, AZtoday
$93k – $110kfrom the posting

BS-level Process Engineering roles on Crosslinked list a median of $112k (598 that show pay).

Model thermal performance and develop solder attach, wire bond and epoxy processes for GaN laser packages

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Worth knowing

Why it is interesting. Own the attach and adhesive processes behind GaN laser light sources used in automotive, AR/VR and LiFi applications.

Might not be for you. Thermal-simulation-heavy mechanical role; polymer/materials work is limited to solder, epoxy and TIM qualification.

Bench and deskGeneralistFast-paced PhD-friendlyBS acceptable Realistic requirements

Adjacent materials rolesolder attach processes (die attach, reflow), epoxies and adhesives, curing mechanisms, TIMs, CTE mismatch, thermal interface materials

Seniority
Mid-level
Work
On-site
Type
Full-time
Degree
BS
Experience
3–8 yrs
Industry
Electronics
Role
Process Engineering

Role details

Job Description

KYOCERA SLD Laser, Inc. (KSLD) is a global leader in the commercialization of gallium nitride (GaN) based laser light sources. As a wholly owned subsidiary of KYOCERA Corporation, KSLD combines advanced laser innovation with the strength, scale, and manufacturing excellence of a global technology leader.

KSLD develops and manufactures high performance LaserLight™ solutions engineered to deliver exceptional brightness, efficiency, and reliability. Our GaN laser technologies enable a wide range of applications, including automotive and mobility, specialty and portable lighting, projection and AR/VR displays, biomedical instrumentation, industrial imaging, and emerging communication technologies such as LiFi. With vertically integrated capabilities and deep technical expertise, KSLD collaborates closely with customers to deliver application specific laser solutions, accelerating development timelines from concept through production.

The company operates advanced R&D and manufacturing facilities in Santa Barbara, CA and Fremont, CA, supporting both innovation and high volume manufacturing needs.

KSLD is ISO 9001 certified and IATF 16949 compliant for automotive applications, and its products meet rigorous UL and IEC safety standards, reflecting a strong commitment to quality, safety, and reliability.

Recognized by Fortune magazine's Best Workplaces in Manufacturing & Production™, KSLD fosters an employee centric culture built on collaboration, technical excellence, and continuous innovation. Guided by a mission to engineer the future of light, KSLD develops laser based solutions that power next generation mobility, consumer, specialty lighting, and industrial technologies.

KSLD will continue to pioneer the future of light by developing, manufacturing and marketing innovative laser based products with high efficiency and luminance for mobility, specialty lighting, consumer, and industrial applications.

To learn more about KSLD, visit www.kyocerasldlaser.com or contact the company at [email protected] or 18667535273.

Experience and Skills

Qualifications

Job Description

We are seeking a highly motivated Mechanical Engineer with strong expertise in thermal and thermal mechanical simulations, solder materials and attach processes, wire bond process and epoxy materials to support the design, development, and reliability of advanced products. This role will focus on thermal management, materials selection, and process development to ensure robust performance and manufacturability.

The ideal candidate will have hands-on experience with thermal modeling tools, a deep understanding of heat transfer, and practical knowledge of soldering and adhesive systems used in high-performance assemblies.

Key Responsibilities

  • Perform thermal simulations and analyses (steady-state and transient) to optimize product performance and reliability
  • Develop and validate thermal models using tools of Solidworks Simulation (FEA), Solidworks Flow Simulation (CFD) or equivalent tools experiences, such as ANSYS, COSMCOL etc.
  • Design and evaluate thermal management solutions (heat sinks, interfaces, TIMs, cooling strategies)
  • Lead or support solder attach process development, including die attach, component attach, and reflow processes
  • Support wire bond process development by defining tools, wires and process parameters to meet product performance and reliability requirements.
  • Select and qualify epoxies and adhesive materials for structural bonding, encapsulation, and thermal interface applications
  • Collaborate with cross-functional teams (electrical, materials, manufacturing, reliability) to ensure design integration.
  • Conduct failure analysis and root cause investigations, with a focus on thermal and material-related issues
  • Define and execute design validation tests (DVT), including thermal cycling, shock, and environmental testing
  • Support manufacturing scale-up by developing process specifications, work instructions, and quality criteria
  • Analyze test data and provide recommendations for design and process improvements

Required Qualifications

  • Bachelor's or Master's degree in Mechanical Engineering or related field
  • 3-8+ years of relevant industry experience
  • Strong understanding of heat transfer principles (conduction, convection, radiation) and key factors of a real thermal system to be able to convert it to a solvable model and get a desired accurate result.
  • Hands-on experience with thermal simulation tools (e.g., Solidworks Simulation, SolidWorks Flow Simulation, ANSYS, COMSOL…)
  • Experience with solder attach processes (die attach, SMT, reflow profiles, reliability concerns such as intermetallic compound formation, voiding, fatigue)
  • Knowledge of epoxies and adhesives, including material properties, curing mechanisms, and application methods
  • Knowledge of hermetic packages, hermeticity definition, as well as how to design it, manufacture it and test it.
  • Familiarity with thermal interface materials (TIMs) and packaging concepts
  • Experience with lab testing and instrumentation (thermocouples, IR cameras, data acquisition)
  • Strong analytical and problem-solving skills

Preferred Qualifications

  • Experience in semiconductor packaging, optoelectronics, or high-power electronics
  • Knowledge of DFM (Design for Manufacturability) and DFR (Design for Reliability)
  • Background in finite element analysis (FEA) for structural and thermo-mechanical modeling
  • Understanding of materials reliability, including CTE mismatch, fatigue, and creep
  • Experience with failure analysis techniques (cross-sectioning, microscopy)
  • Familiarity with industry standards (MIL, ISO, IATF)
  • Programming or scripting skills (Python, MATLAB, JMP) for data analysis
  • Experience working in a fast-paced, cross-functional development environment

Key Competencies

  • Strong technical depth in thermal and materials engineering
  • Ability to translate simulation results into practical design improvements
  • Effective communication and collaboration skills
  • Detail-oriented with a focus on quality and reliability
  • Self-driven and capable of managing multiple priorities

The full-time base salary range for the Mechanical Engineer position is $93,000 to $110,000 per annum. The range reflects the minimum and maximum possible base salary for new hires for the role, based on the advertised location. Individual pay is determined by several factors including work location, job-related skills, experience, and relevant education and training. For more information about the base salary range applicable to the work location, talk to the recruiter.

Kyocera SLD Laser, Inc. is an equal opportunity employer. We do not discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, legally protected medical condition, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by local, state, or federal laws

The above statements are intended to describe the general nature and level of work being performed by people assigned to this job. They are not intended to be an exhaustive list of all responsibilities, duties, and requirements of personnel as classified.

Job Benefits

Medical, Dental, Vision and 401k

From: KYOCERA SLD Laser, Inc

Related roles

Common questions

What is the salary for the Mechanical Engineer role at KYOCERA SLD Laser, Inc.?

The listed annual base salary range is $93K–$110K. This figure is taken from the posting itself.

Does KYOCERA SLD Laser, Inc. sponsor H-1B visas?

KYOCERA SLD Laser, Inc. has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Mechanical Engineer role. Confirm with the employer before applying if visa support is required.

Where is the Mechanical Engineer role at KYOCERA SLD Laser, Inc. based?

This role is based in Tucson, AZ.

What degree is required for the Mechanical Engineer role at KYOCERA SLD Laser, Inc.?

This role requires a BS.

How many years of experience does this Mechanical Engineer role require?

The posting calls for 3–8 years of relevant experience.

What polymers or materials does this Mechanical Engineer role work with?

solder materials, epoxies, adhesives, thermal interface materials.

What techniques or methods are required for this Mechanical Engineer role?

thermocouples, IR cameras, data acquisition, thermal cycling, environmental testing.