What is the salary for the Principal Packaging Engineer role at Skyworks Solutions, Inc.?

The listed annual base salary range is $129K–$248K. This figure is taken from the posting itself.

Does Skyworks Solutions, Inc. sponsor H-1B visas?

Skyworks Solutions, Inc. has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Principal Packaging Engineer role. Confirm with the employer before applying if visa support is required.

Where is the Principal Packaging Engineer role at Skyworks Solutions, Inc. based?

This role is based in Irvine, CA.

What degree is required for the Principal Packaging Engineer role at Skyworks Solutions, Inc.?

The posting accepts the following combinations: BS + 12 years, MS + 8 years.

How many years of experience does this Principal Packaging Engineer role require?

The posting calls for at least 12 years of relevant experience.

What techniques or methods are required for this Principal Packaging Engineer role?

reliability testing, process DOE.

One of 6,357 open polymer and materials roles on Crosslinked, each read for materials, degree, visa and salary. See roles like this

H-1B history

Principal Packaging Engineer

Q: What polymers or materials does this Principal Packaging Engineer role work with?

organic laminate, overmold compounds.

Skyworks Solutions, Inc. · Irvine, CA1mo agoverified 14 h ago

$129k – $248k

BS-level Process Engineering roles on Crosslinked list a median of $113k (683 that show pay).

Own advanced laminate/RF SiP packaging from feasibility through high-volume production

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Electronic materials · Process Engineering roles, by email

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Worth knowing

Why it is interesting. Sets the packaging technology roadmap and leads strategic initiatives across internal and OSAT manufacturing.

Might not be for you. Requires 12+ years (or MS + 8) in semiconductor packaging — not an early-career or polymer-synthesis role.

Bench and deskDeep specialistFast-paced Senior hires only

Adjacent materials roleidentifying new materials and equipment; organic laminate technologies; overmolded laminate module packaging; Die Attach, Molding

H-1B filings

Skyworks Solutions, Inc. filed 20 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Engineering Manager 2, Sr. Materials/Planning Specialist 1, Process Engineer 2. Median filed pay: $121K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority: Staff/Principal
Work: On-site
Type: Full-time
Degree: BS
Experience: 12+ yrs
Industry: Semiconductor
Role: Process Engineering

Materials

organic laminateovermold compoundslead-frame materials

Techniques

reliability testing15 rolesprocess DOEfailure analysis140 roles

Benefits

premium-free medical plan optionemployee stock purchase plan

Role details

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 77070

Description

We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP) modules. Candidate will be the RF packaging interface between multi-functional groups within Skyworks and internal/external manufacturing.
This position offers significant opportunities for growth, including leading strategic packaging initiatives and influencing Skyworks packaging technology roadmap. Leadership experience, either as a program manager, people manager, or technical lead is a strong plus.
On-site location is flexiable. Desired location in San Jose CA or Irvine CA.

Responsibilities

Working with IC design teams to define and implement the package requirements.
Ownership of specific product from feasibility stage to high volume production.
Ensuring that DFM/BKM is implemented for assembly yield, cost, and reliability.
Developing new assembly technologies, running process DOE’s, identifying new materials and equipment, reliability testing, and qualification of new assembly process.

Required Experience And Skills

BS Degree in either Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science.
Minimum 12 years experience (or MS and 8 years) in semiconductor packaging technology
Strong project management and communication skills (verbal, written, and presentation).
Expertise with overmolded laminate module packaging processes: SMT, Wirebonding, Die Attach, and Molding.
Knowledge of various assembly processes: Flip Chip Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs.
Experience in Advanced RF SiP Moldules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding,
Experience working with OSAT Assembly Factories in Asia.

Desired Experience And Skills

Solid understanding of Design Rules Check and Design for Manufacturing
Hands on experience with assembly process/equipment.
Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
Understanding of RF products and concepts is highly desired.
Experience with Failure Analysis.
Understanding of Module and Board Level Reliability requirements.
Understanding of manufacturing of organic laminate technologies.
Experience with Lead-Frame Packaging.
Prior R&D experience of advanced packaging concepts.

The typical base pay range for this role across the U.S. is currently USD $129,400 - $247,800 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others.

Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at [email protected].