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TI

Process Engineering Intern

Texas Instruments · Lehi, UTtoday

PhD-level Process Engineering roles on Crosslinked list a median of $133k (26 that show pay). This posting does not list pay.

Intern on interconnect process integration, analyzing yield data and metal/dielectric reliability for analog semiconductor technology.

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Worth knowing

Why it is interesting. Work on metal and dielectric interconnect reliability for next-generation analog power and precision technologies.

Might not be for you. Yield and test-circuit focus; PhD-student requirement rules out undergrads.

Deep specialist PhD-friendlyInternship-friendly

Adjacent materials roleAssess reliability of the metal and dielectric of the interconnect system; preferred strong materials background in metal and/or dielectrics

H-1B filings

Texas Instruments filed 38 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Validation Engineering Manager, Analog Design Manager, Digital Design Manager. Median filed pay: $166K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings

Seniority
Intern/Co-op
Work
On-site
Type
Internship
Degree
PhD
Experience
0+ yrs
Industry
Semiconductor
Role
Process Engineering
Materials
metal interconnectsdielectrics20 roles
Benefits
equity/stock

Role details

Change the world. Love your job. Texas Instruments is seeking a Process Engineering Intern within the Analog Technology Development (ATD) Group. We work to define and develop the next generation process and device technologies for TI. The metal system is critical for achieving reliable, low resistance interconnects for power devices, for enabling area scaling and high process yields to drive cost leadership and to achieve high precision resistors and capacitor components.

The interconnect process integration engineer is a key member of a team that defines and develops the processes and process flows to achieve the interconnect performance and reliability needs, whether it be low resistance with good electro-migration capability for the latest high current applications or high precision resistors for high performance amplifiers.

The role includes activities such as: defining electrical test circuits to assess process capability versus design rule, characterizing and analyzing process yield data, assessing the reliability of the metal and dielectric of the interconnect system, and then working within the team to drive the necessary actions to meet the yield and reliability needs for the technology. Minimum requirements: Currently pursuing PhD in areas such as Materials Science, Electrical Engineering, Physics, Chemistry or related engineering degree.

Cumulative 3.0/4.0 GPA or higher Preferred qualifications: Strong materials background in metal and/or dielectrics Strong verbal and written communication skills Ability to work in teams and collaborate effectively with people in different functions Ability to take the initiative and drive for results, influential relationships Good listener and excellent verbal and written communication skills

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Common questions

Does Texas Instruments sponsor H-1B visas?

Texas Instruments has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Process Engineering Intern role. Confirm with the employer before applying if visa support is required.

Where is the Process Engineering Intern role at Texas Instruments based?

This role is based in Lehi, UT.

What degree is required for the Process Engineering Intern role at Texas Instruments?

This role requires a PhD.

How many years of experience does this Process Engineering Intern role require?

The posting calls for at least 0 years of relevant experience.

What polymers or materials does this Process Engineering Intern role work with?

metal interconnects, dielectrics.