Dry/Plasma Etch Process Development Engineer (R&D)
MS-level Process Engineering roles on Crosslinked list a median of $155k (59 that show pay). This posting does not list pay.
Develop and optimize FEOL/BEOL plasma etch unit processes for semiconductor devices, taking them from development to volume production.
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Worth knowing
Why it is interesting. Own FEOL/BEOL dry etch development for advanced semiconductor devices, from R&D through volume production.
Might not be for you. Requires an MS in EE/ME and 2+ years of fab plasma etch experience; no explicit polymer or materials science focus.
Adjacent materials roleDevelop, characterize and optimize plasma etch unit processes (FEOL/BEOL) for semiconductor devices; 2+ yrs plasma etch process experience in the fab
H-1B filings
Texas Instruments filed 38 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.
Most common titles: Validation Engineering Manager, Analog Design Manager, Digital Design Manager. Median filed pay: $166K a year.
From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings
- Seniority
- Mid-level
- Work
- On-site
- Type
- Full-time
- Degree
- MS
- Experience
- 2+ yrs
- Industry
- Semiconductor
- Role
- Process Engineering
Role details
Change the world. Love your job. Process Development Engineer responsible for the development, characterization and optimization of plasma etch unit processes (FEOL/BEOL) for semiconductor devices that meet the requirements for volume production as part of the advanced technology development team. The ideal candidate will be a technical leader in the area of plasma etching driving the characterization and optimization of the device and process to insure robustness, reliability, and manufacturability meeting all electrical device performance targets.
Responsibilities include: Drive process and device improvements through characterization, test, design of experiments, data analysis and simulation Work with multiple process, integration, reliability, packaging and test engineers to achieve these goals Work closely with the product groups to identify and optimize the dry etch unit processes to meet critical final device parameters to enable game changing products in the market. The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries.
They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.
Minimum requirements: Masters in Electrical Engineering, Mechanical Engineering or related engineering degree 2+ years of experience working on plasma etch unit processes in the fab and taking them from development to production on schedule Preferred qualifications: Ability to establish strong relationships with key stakeholders critical to success, both internally and externally Strong verbal and written communication skills Ability to quickly ramp on new systems and processes Demonstrated strong interpersonal, analytical and problem-solving skills Ability to work in teams and collaborate effectively with people in different functions Ability to take the initiative and drive for results Strong time management skills that enable on-time project delivery
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