Professor (All Ranks): Advanced Semiconductor Packaging Focused on Co-packaged Optics
PhD-level Academic / Postdoc roles on Crosslinked list a median of $100k (225 that show pay). This posting does not list pay.
Build a funded research program and teach in advanced semiconductor packaging, including co-packaged optics and heterogeneous integration.
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Worth knowing
Why it is interesting. Access to the Materials-to-Fab Center with Applied Materials, NanoFab and the DoW-backed SWAP Hub for lab-to-fab prototyping
Might not be for you. Housed in Electrical Engineering and centered on packaging design and integration, not polymer or materials science research.
Adjacent materials roleFaculty search in Advanced Semiconductor Packaging: 2.5D/3D heterogeneous integration, bonding, thermal management; SHIELD USA materials and substrates for advanced packaging
H-1B filings
Arizona State University filed 35 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.
Most common titles: Assistant Professor, Assistant Research Scientist, Postdoctoral Research Scholar. Median filed pay: $89K a year.
Universities are exempt from the H-1B cap, so roles here skip the lottery.
From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay ·Every employer's filings
- Seniority
- Entry level
- Work
- On-site
- Type
- Full-time
- Degree
- PhD
- Industry
- Semiconductor
- Role
- Academic / Postdoc
Role details
The Ira A. Fulton Schools of Engineering at Arizona State University (ASU) and the School of Electrical, Computer and Energy Engineering seek applicants for a tenure-track or tenured faculty position in the area of Advanced Semiconductor Packaging. The School of Electrical, Computer and Energy Engineering, one of the eight Ira A. Fulton Schools of Engineering, houses a vibrant electrical engineering research community (learn more at https://research.engineering.asu.edu/ ). We seek applicants who can enhance our abilities in these areas as part of a community of experts.
Particular areas of interest include, but are not limited to, co-packaged optics, advanced packaging/bonding to support 2.5D and 3D heterogeneous integration, package-based co-design and modeling, thermal management, power management, design for manufacturability, and package-based reliability and prognostics. We seek applicants who will contribute to our academic programs, promote transdisciplinary teaching and research, and help the university to achieve its aspirations, including enabling student success, transforming society, valuing entrepreneurship, and conducting use-inspired research.
Faculty members in the Fulton Schools are expected to develop an internationally recognized and externally funded research program, adopt effective pedagogical practices in the development and delivery of undergraduate and graduate courses, advise on both undergraduate and graduate student research and projects, and undertake service activities. The School of Electrical, Computer and Energy Engineering’s research areas reflect the variety of the electrical engineering profession and our faculty’s expertise, ranging from the smallest nanoelectronics to the U.S. power grid and its control.
Graduate students are involved in all of our research activities and have access to state-of-the-art facilities, such as the NanoFab microelectronics fabrication space on the ASU Tempe campus and the MacroTechnology Works facility, a former semiconductor plant converted to lab space. Six primary areas of specialization are control systems; electric power and energy systems; electromagnetics, antennas and microwaves; electronics and mixed-signal design; physical electronics and photonics; and signal processing and communications.
In addition, new faculty hired through this search will find exciting opportunities to participate in the activities of the Southwest Advanced Prototyping (SWAP) Hub. Led by Arizona State University, the SWAP Hub is one of eight regional innovation hubs established under the Department of War’s Microelectronics Commons, a national strategic initiative to accelerate the development and production of microelectronics technologies that are critical to U.S. security and defense. With over 170 partners, the SWAP Hub provides unprecedented opportunities for large-scale collaboration to advance microelectronics prototyping and lab-to-fab transition.
Arizona State University is also leading the SHIELD USA project in materials and substrates for advanced packaging through the National Advanced Packaging Manufacturing Program . The recently opened Materials-to-Fab (MTF) Center, a collaboration with Applied Materials, features upgraded infrastructure to support state-of-the-art semiconductor tools, making ASU one of the few U.S. universities with access to leading-edge equipment for research, workforce development, and government-backed prototyping initiatives.
The MTF Center combines Applied Materials’ leadership in materials engineering with ASU’s multi-disciplinary R&D expertise, creating a model that accelerates the transfer of innovations from ideation to fab prototype. Appointment will be at the a ssistant, associate, or full professor rank , commensurate with the candidate’s experience and accomplishments, beginning August 2026.
Essential Functions
Contribute to curriculum development. Deliver instruction in-person and/or online. Supervise honors, master’s, and doctoral students. Conduct research publishable in top-tier journals and/or conferences in the discipline. Develop grant proposals for external funding as PI or co-PI. Participate in professional and internal service.
Required qualifications
Earned a doctorate in Electrical Engineering or a related discipline by the time of appointment. Evidence of excellence in research, as appropriate to the candidate’s rank. Evidence of excellence in teaching, as appropriate to the candidate’s rank. Desired qualifications Demonstrated commitment to a collaborative, transdisciplinary approach to research and teaching. Commitment to inclusive research and teaching practices. Commitment to curriculum development and innovative pedagogy. Commitment to mentoring students and delivering courses in multiple technology-enhanced formats. Record of impactful publications in top-tier journals/conferences in advanced packaging.
A record of acquiring external funding. A demonstrated appreciation for entrepreneurial activities.
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