ALD Thin Film Process Development Engineer

Role details

Texas Instruments' Advanced Technology Development team is looking for an energetic engineer with a passion for process development. This position provides the opportunity to enable new technologies for future Texas Instruments revenue growth. We are searching for a self-directed, highly motivated engineer to join our Lehi, UT Process Development team. The responsibilities of a Process Development Engineer in this role include: Develop new processes and define processing and equipment requirements, specifications, and manufacturing methods for advanced semiconductor applications.

Influence process integration schemes and support technology development from early paper studies and pilot work through full-scale manufacturing. Translate business unit roadmap requirements into pathfinding and process development projects. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications Lead or support projects involving new process concepts, equipment selection, chemistry development, automation technologies, and novel manufacturing approaches. Provide technical engineering support in manufacturing and drive process and equipment modifications that improve production efficiency, technical capability, and yield.

Develop and apply statistical methods, including Design of Experiments (DOE) and Statistical Process Control (SPC), to identify physical causes of yield loss and improve quality. Partner with equipment suppliers and vendors to define and execute equipment and process development roadmaps. Work across 300mm deposition platforms, including current single-wafer ALD and CVD systems.

Minimum requirements: Master’s degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field 5+ years relevant experience in 300mm Advanced (<32nm) logic device or advanced memory device technologies Working knowledge of Process development, characterization and control of Thin films processing equipment, CVD, PE-CVD, Single-wafer ALD Strong supplier engagement skillset Strong foundation in statistical process control, Design of Experiments (DOE), data analysis, model-based problem solving, engineering change control, and process release strategies Preferred qualifications: 5 years relevant experience in 300mm Advanced logic of advanced memory device technologies: Specific experience on RMG products Working knowledge of advanced CMOS device physics and reliability mechanisms Hands on Process Experience across multiple 300mm deposition platforms for dielectric, High-K and Metals Experience with Single-wafer ALD such as ASM XP4 Pulsar & XP8 platforms, as well as Batch ALD platforms Familiarity with 300mm Semiconductor Single wafer Thermal, RTA, Laser Anneal systems Direct R&D experience in 300mm semiconductors Experience with HKMG, Silicon Photonics Device physics training with understanding of materials, material evolution; structural characterization and electrical test characterization Data analysis skills Ability to work in teams and collaborate effectively with people in different functions and locations Strong relationship-building, communication, time management, and results-oriented collaboration skills to enable on-time project delivery