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Principal Packaging Design Integration Engineer (2027 New College Graduate)

GlobalFoundries · Malta, NY,yesterday
$85k – $146k

MS-level Product Development roles on Crosslinked list a median of $130k (15 that show pay).

Co-design electro-optical chip packages for SiPh 2.5D/3D co-packaged optics, covering design rules, materials selection and reliability.

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Worth knowing

Why it is interesting. Work on co-packaged optics with GF's Photonix platform, combining thermal, mechanical, electrical and optical package design.

Might not be for you. Mostly modeling and design-rule work; materials science is only a preferred background, not the core of the role.

Mostly desk workDeep specialist PhD-friendlyFirst industry role

Adjacent materials role:materials selection criteria for chip package co-design; preferred: materials science, thermal, mechanical background; chip package interaction in 2.5D/3D advanced packaging

H-1B filings

GlobalFoundries filed 58 H-1B labor applications for scientist and engineer roles from Jan to Dec 2025.

Most common titles: Sr Engineer Process Engineering, Sr Engineer Integration Engineering, Principal Eng Equipment Engineering. Median filed pay: $102K a year.

From U.S. Department of Labor disclosure data. A filing is a record of past hiring, not a promise about this role, so confirm sponsorship with the employer. Titles and filed pay · Every employer's filings

Seniority
Staff/Principal
Work
On-site
Type
Full-time
Degree
MS
Experience
2+ yrs
Industry
Semiconductor
Role
Product Development

Role details

About GlobalFoundries: GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power‑efficient and high‑performance solutions for high‑growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com.

Summary of Role: GlobalFoundries (GF) seeks a hands-on Assembly Integration Design Engineer that will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors. The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design, with a focus on product and module performance, reliability, packaging design rules, materials selection criteria, and definition of electrical, photonic and thermal requirements for chiplet and product modules.

Essential Responsibilities: Drive SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems. Support new customer products with innovative design solutions and technology design rules. Drive design reviews with cross functional teams Drive cross functional teams to resolve technical & yield concerns Develop engineering team skills in packaging design constraints and considerations Develop complex analysis models to predict manufacturability, cost, and quality.

Protect the business by ensuring that all necessary requirements are met and that the technology meets the expectations of customers and markets to avoid costly re-designs. Foster discipline and qualification robustness through a consistent global design process Drive CIP (Continuous improvement plans) to deliver organizational goals.

Other Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs Travel <10% to other GlobalFoundries facilities may be necessary Required Qualifications: PhD, or MS + 2 or more years of experience Experience in bringing packaged products from development into production. Experience with HFSS, Zmax, Flotherm, or other design and modeling tools. Advanced packaging design and layout expertise Strong written and spoken English communication skills Preferred Qualifications: Materials science, thermal, mechanical, simulation background.

Experience with failure analysis, design of experiments, & packaging process integration. Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem. Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging. Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing. Expected Salary Range $85,000.00 - $146,000.00 The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address. An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

Common questions

What is the salary for the Principal Packaging Design Integration Engineer (2027 New College Graduate) role at GlobalFoundries?

The listed annual base salary range is $85K–$146K. This figure is taken from the posting itself.

Where is the Principal Packaging Design Integration Engineer (2027 New College Graduate) role at GlobalFoundries based?

This role is based in Malta, NY.

What degree is required for the Principal Packaging Design Integration Engineer (2027 New College Graduate) role at GlobalFoundries?

The posting accepts the following combinations: PhD + 0 years, MS + 2 years.

How many years of experience does this Principal Packaging Design Integration Engineer (2027 New College Graduate) role require?

The posting calls for at least 2 years of relevant experience.

What techniques or methods are required for this Principal Packaging Design Integration Engineer (2027 New College Graduate) role?

failure analysis, design of experiments.