Principal Laser Packaging Engineer (Semiconductor Venture)

Role details

Principal Laser Packaging Engineer

TopoLight is a venture-backed deep tech startup commercializing novel high-power photonic crystal lasers (PCSELs).

We’re looking for a principal engineer who will own the packaging of our laser module. You’ll take a high-power laser die from concept to a manufacturable, taped- out package. You’ll own the thermal path, the die-attach and bonding strategy, and the integration that determines whether the device meets its wavelength, efficiency, and reliability targets, and drive it through assembly and characterization to make it real.

*Note: This job posting was placed by Liminal, we're the venture builder that is backing TopoLight.*

Responsibilities

• Own the laser package architecture from concept through tape-out
• Design the thermal path, from die-attach to the submount, heat-spreader and cooler
• Translate device performance targets into a manufacturable package that holds emission wavelength and efficiency across the range of operation
• Model the thermal and mechanical behavior of the device and correlate against measured junction temperature, wavelength, and rollover
• Debug and iterate problems quickly in a fast-moving environment

Qualifications

• B.S. or M.S. in EE, Materials Science, Physics, Mechanical or Optical Engineering, or equivalent, with hands-on laser or optoelectronic packaging experience
• Demonstrated experience packaging high-power CW semiconductor lasers
• Has taken at a laser die from concept to a taped-out, working package
• Solid understanding of how thermals impact and drive laser behavior
• Comfortable owning ambiguous problems in a startup environment
• Strong written and verbal communication, with a collaborative working style

Compensation

As a principal engineer, you will receive a significant stake of equity in TopoLight. Salary will

range from $135k - $165k based on experience, with a large stock allotment.