Laser Packaging Lead

Role details

Laser Packaging Engineer

Santa Barbara / Goleta, CA

I’m working with a rapidly scaling advanced hardware and engineering company looking to hire a Senior Laser Packaging Engineer to take ownership of its high power semiconductor laser packaging capability.

This is a hands-on technical leadership role with a broad mandate; build the packaging platform, stand up the cleanroom, develop the processes, and build the team that takes devices from wafer/bar level through to reliable packaged hardware.

The role will own:

• High-power laser packaging across die attach, solder processes, wire bonding, subcarriers and thermal stack-ups

• Packaging process development, qualification and reliability

• Cleanroom buildout, including equipment selection, installation and qualification

• Thermal management and package design for high-power laser devices

• Building and leading a team of packaging engineers and technicians

• Moving packaging from R&D/prototype builds toward repeatable production

• Working closely with device, materials, test and reliability engineering teams

Key experience:

• Strong hands-on semiconductor or laser packaging background

• High-power laser bars, VCSEL, PCSEL or closely related photonic devices

• Die attach, wire bonding, solder/reflow and subcarrier design

• Thermal modeling and high-heat-flux packaging

• Packaging process development and qualification

• Experience taking hardware from prototype into repeatable production

• Previous technical/team leadership experience strongly preferred

This is an opportunity to own the function rather than inherit a mature process. You’ll have responsibility for building the packaging capability, infrastructure and team around a new generation of high power photonic devices.

Santa Barbara / Goleta, CA. Onsite position, with some flexibility for hybrid model.

Full-time direct hire only; no C2C. Candidates must qualify as a U.S. Person under ITAR requirements.